RO4360G2 32mil substrate Double-Sided Copper Clad Laminate built for RF Microwave Multi Layer Hybrid PCB

Double-Sided Copper Clad Laminate with Rogers RO4360G2

The double-sided copper clad laminate built with Rogers RO4360G2 is designed for high-frequency RF and microwave applications. With a 32mil (0.813mm) RO4360G2 substrate, finished thickness of 0.9mm, and 1oz copper layers, this laminate provides high dielectric performance, low loss, and thermal reliability. It is compatible with FR-4 processing techniques, making it a cost-effective and efficient solution for both single- and multi-layer circuit designs.

Key Construction Details

Rogers RO4360G2 delivers high dielectric constant (Dk = 6.15 ± 0.15 @ 10GHz) and low dissipation factor (Df = 0.0038 @ 10GHz), ensuring superior signal integrity and high-frequency stability.

PCB Stackup

The 2-layer rigid PCB stackup is designed for high-frequency and high-power performance with a 32mil (0.813mm) RO4360G2 substrate sandwiched between two copper layers.

Introduction to Rogers RO4360G2

Rogers RO4360G2 is a high-performance thermoset laminate combining glass-reinforced hydrocarbon ceramics with FR-4 process compatibility. It offers high dielectric constant (Dk) and low loss properties, making it ideal for high-frequency circuits. The material is rigid and suitable for plated through-hole designs while maintaining low material and fabrication costs. Its lead-free compatibility and environmental compliance make it well-suited for modern manufacturing standards.

Why Choose Rogers RO4360G2?

1. High Dielectric Constant (Dk): At 6.15 ± 0.15 @ 10GHz, this material enables compact, high-frequency designs with improved circuit density.
2. Low Loss Performance: With a Df of 0.0038 @ 10GHz, it supports efficient signal transmission and minimal insertion loss.
3. Cost-Effective Processing: Compatible with standard FR-4 techniques, reducing fabrication costs without sacrificing performance.
4. Thermal Reliability: Features a high decomposition temperature (Td > 407°C) and thermal conductivity of 0.75W/mK, ensuring durability in high-power applications.

Key Features of Rogers RO4360G2 Copper Clad Laminate

• Dielectric Constant (Dk): 6.15 ± 0.15 at 10GHz, optimized for miniaturized, high-density circuit designs.
• Low Dissipation Factor (Df): 0.0038 at 10GHz, ensuring minimal signal loss for high-frequency applications.
• Thermal Stability: High Td (>407°C) and Tg >280°C, ensuring reliable performance in harsh environments.
• Low Z-Axis CTE: 28 ppm/°C, providing dimensional stability and reducing the risk of delamination during thermal cycling.
• High Thermal Conductivity: 0.75 W/mK, offering excellent heat dissipation for high-power designs.
• Plated Through-Hole Reliability: Enhanced rigidity ensures robust PTH designs with improved reliability.
• Lead-Free Process Compatibility: Fully compliant with modern, environmentally friendly manufacturing processes.
• UL 94-V0 Flammability Rating: Meets strict safety and environmental standards.

Conclusion

The double-sided copper clad laminate with Rogers RO4360G2 is a high-performance material optimized for high-frequency RF and microwave designs. Its high dielectric constant, low loss, and superior thermal performance make it ideal for base station amplifiers, small cell transceivers, and high-power RF circuits. While its higher cost may limit its use in general-purpose designs, its outstanding signal integrity and environmental compliance ensure reliable operation for next-generation electronic systems.