|
| MOQ: | 1개 |
| 가격: | 0.99-99USD/PCS |
| 표준 포장: | 포장 |
| 배달 기간: | 2-10 근무일 |
| 지불 방법: | T/T, PayPal |
| 공급 능력: | 50000개 |
RT/duroid® 5880LZ Copper-Clad Laminate: A High-Performance Solution for Demanding RF/Microwave Applications
RT/duroid® 5880LZ is a high-frequency laminate engineered by Rogers Corporation specifically for precision stripline and microstrip circuits. It belongs to a family of filled polytetrafluoroethylene (PTFE) composites, distinguished by a unique filler system that yields a low-density, lightweight material. This makes it particularly advantageous for weight-sensitive, high-performance applications such as aerospace, satellite communications, and advanced radar systems.
The material’s standout characteristic is its exceptionally low and stable dielectric constant (Dk) of 2.00 ± 0.04 (typical at 10 GHz), which is highly uniform across panels and remains consistent over a broad frequency range from 8 GHz to 40 GHz. This stability is crucial for predictable electrical performance in high-frequency designs. Coupled with a very low dissipation factor (Df), typically 0.0021 at 10 GHz, RT/duroid 5880LZ exhibits minimal signal loss, extending its effective usability well into the Ku-band and beyond. Its thermal coefficient of dielectric constant is a low +20 ppm/°C, ensuring stable electrical properties across operational temperature ranges.
Beyond its electrical excellence, the laminate offers robust mechanical and thermal properties. It features a low coefficient of thermal expansion (CTE), with 54 ppm/°C in the X/Y plane and 40 ppm/°C in the Z-axis, promoting reliability during thermal cycling. The material is easily machined (cut, sheared, drilled) and is resistant to solvents and reagents used in standard PCB fabrication processes. It also boasts excellent flammability ratings (UL 94 V-0) and is fully compatible with lead-free assembly processes.
| Property | Typical Value [1] RT/duroid® 5880LZ |
Direction | Units | Condition | Test Method |
| Dielectric Constant ε , Process |
2.00 ± 0.04 | Z | 10 GHz/23°C | IPC-TM-650, 2.5.5.5 | |
| [2] Dielectric Constant ε, Design | 2 | Z | 8 GHz - 40 GHz | Differential Phase Length Method | |
| Dissipation Factor, tan | Typ: 0.0021 | Z | 10GHz/23°C | IPC-TM-650, 2.5.5.5 | |
| Max: 0.0027 | |||||
| Thermal Coefficient of Dielectric Constant, ε, | 20 | Z | ppm/°C | -50°C to 150°C 10GHz | IPC-TM-650, 2.5.5.5 |
| Volume Resistivity | 1.74 X 107 | Mohm•cm | C-96/35/90 | IPC-TM-650, 2.5.17.1 | |
| Surface Resistivity | 2.08 X 106 | Mohm | C-96/35/90 | IPC-TM-650, 2.5.17.1 | |
| Electrical Strength | 40 | kV | D48/50 | IPC-TM-650, 2.5.6 | |
| Dimensional Stability | -0.38 | X,Y | % | IPC-TM-650, 2.4.39A | |
| Moisture Absorption | 0.31 | % | 24 hours/23°C | IPC-TM-650, 2.6.2.1 | |
| Thermal Conductivity | 0.33 | Z | W/m/°K | 80°C | ASTM C518 |
| Coefficient of Thermal Expansion | 54,47 | X,Y | ppm/°C | 0 to 150°C | IPC-TM-650, 2.4.41 |
| 40 | Z | ||||
| Outgassing | |||||
| % | ASTM E-595 | ||||
| TML | 0.01 | ||||
| CVCM | 0.01 | ||||
| WVR | 0.01 | ||||
| Density | 1.4 | gm/cm3 | ASTM D792 | ||
| Copper Peel | >4.0 | pli | IPC-TM-650, 2.4.8 | ||
| Flammability | V-O | UL 94 | |||
| Lead-Free Process Compatible | YES | ||||
Standard Specifications for the Substrate:
Thicknesses: Available in 0.010" (0.252 mm), 0.020" (0.508 mm), and 0.050" (1.270 mm) with specified tolerances. Additional non-standard thicknesses from 0.0075" to 0.200" are available upon request.
Panel Sizes: Typically supplied in 12" x 18" (305 mm x 457 mm) and 24" x 18" (610 mm x 457 mm) panels, with other sizes potentially available.
Standard Claddings: Offered with electrodeposited copper foil in standard weights of ½ oz (18 µm) and 1 oz (35 µm), designated as HH/HH and *H1/H1* respectively, indicating double-sided cladding. Other foil weights can be sourced.
Key Property Benchmarks: The datasheet provides typical values for critical parameters, including volume resistivity (>10⁷ MΩ·cm), moisture absorption (0.31%), thermal conductivity (0.33 W/m/°K), and copper peel strength (>4.0 pli), ensuring adherence to industry standards (IPC, ASTM).
In summary, RT/duroid 5880LZ is a premier, lightweight laminate that delivers an optimal balance of stable low Dk, ultra-low loss, and reliable mechanical properties, making it an ideal choice for designers of high-frequency circuits where performance consistency, signal integrity, and weight are paramount.
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|
| MOQ: | 1개 |
| 가격: | 0.99-99USD/PCS |
| 표준 포장: | 포장 |
| 배달 기간: | 2-10 근무일 |
| 지불 방법: | T/T, PayPal |
| 공급 능력: | 50000개 |
RT/duroid® 5880LZ Copper-Clad Laminate: A High-Performance Solution for Demanding RF/Microwave Applications
RT/duroid® 5880LZ is a high-frequency laminate engineered by Rogers Corporation specifically for precision stripline and microstrip circuits. It belongs to a family of filled polytetrafluoroethylene (PTFE) composites, distinguished by a unique filler system that yields a low-density, lightweight material. This makes it particularly advantageous for weight-sensitive, high-performance applications such as aerospace, satellite communications, and advanced radar systems.
The material’s standout characteristic is its exceptionally low and stable dielectric constant (Dk) of 2.00 ± 0.04 (typical at 10 GHz), which is highly uniform across panels and remains consistent over a broad frequency range from 8 GHz to 40 GHz. This stability is crucial for predictable electrical performance in high-frequency designs. Coupled with a very low dissipation factor (Df), typically 0.0021 at 10 GHz, RT/duroid 5880LZ exhibits minimal signal loss, extending its effective usability well into the Ku-band and beyond. Its thermal coefficient of dielectric constant is a low +20 ppm/°C, ensuring stable electrical properties across operational temperature ranges.
Beyond its electrical excellence, the laminate offers robust mechanical and thermal properties. It features a low coefficient of thermal expansion (CTE), with 54 ppm/°C in the X/Y plane and 40 ppm/°C in the Z-axis, promoting reliability during thermal cycling. The material is easily machined (cut, sheared, drilled) and is resistant to solvents and reagents used in standard PCB fabrication processes. It also boasts excellent flammability ratings (UL 94 V-0) and is fully compatible with lead-free assembly processes.
| Property | Typical Value [1] RT/duroid® 5880LZ |
Direction | Units | Condition | Test Method |
| Dielectric Constant ε , Process |
2.00 ± 0.04 | Z | 10 GHz/23°C | IPC-TM-650, 2.5.5.5 | |
| [2] Dielectric Constant ε, Design | 2 | Z | 8 GHz - 40 GHz | Differential Phase Length Method | |
| Dissipation Factor, tan | Typ: 0.0021 | Z | 10GHz/23°C | IPC-TM-650, 2.5.5.5 | |
| Max: 0.0027 | |||||
| Thermal Coefficient of Dielectric Constant, ε, | 20 | Z | ppm/°C | -50°C to 150°C 10GHz | IPC-TM-650, 2.5.5.5 |
| Volume Resistivity | 1.74 X 107 | Mohm•cm | C-96/35/90 | IPC-TM-650, 2.5.17.1 | |
| Surface Resistivity | 2.08 X 106 | Mohm | C-96/35/90 | IPC-TM-650, 2.5.17.1 | |
| Electrical Strength | 40 | kV | D48/50 | IPC-TM-650, 2.5.6 | |
| Dimensional Stability | -0.38 | X,Y | % | IPC-TM-650, 2.4.39A | |
| Moisture Absorption | 0.31 | % | 24 hours/23°C | IPC-TM-650, 2.6.2.1 | |
| Thermal Conductivity | 0.33 | Z | W/m/°K | 80°C | ASTM C518 |
| Coefficient of Thermal Expansion | 54,47 | X,Y | ppm/°C | 0 to 150°C | IPC-TM-650, 2.4.41 |
| 40 | Z | ||||
| Outgassing | |||||
| % | ASTM E-595 | ||||
| TML | 0.01 | ||||
| CVCM | 0.01 | ||||
| WVR | 0.01 | ||||
| Density | 1.4 | gm/cm3 | ASTM D792 | ||
| Copper Peel | >4.0 | pli | IPC-TM-650, 2.4.8 | ||
| Flammability | V-O | UL 94 | |||
| Lead-Free Process Compatible | YES | ||||
Standard Specifications for the Substrate:
Thicknesses: Available in 0.010" (0.252 mm), 0.020" (0.508 mm), and 0.050" (1.270 mm) with specified tolerances. Additional non-standard thicknesses from 0.0075" to 0.200" are available upon request.
Panel Sizes: Typically supplied in 12" x 18" (305 mm x 457 mm) and 24" x 18" (610 mm x 457 mm) panels, with other sizes potentially available.
Standard Claddings: Offered with electrodeposited copper foil in standard weights of ½ oz (18 µm) and 1 oz (35 µm), designated as HH/HH and *H1/H1* respectively, indicating double-sided cladding. Other foil weights can be sourced.
Key Property Benchmarks: The datasheet provides typical values for critical parameters, including volume resistivity (>10⁷ MΩ·cm), moisture absorption (0.31%), thermal conductivity (0.33 W/m/°K), and copper peel strength (>4.0 pli), ensuring adherence to industry standards (IPC, ASTM).
In summary, RT/duroid 5880LZ is a premier, lightweight laminate that delivers an optimal balance of stable low Dk, ultra-low loss, and reliable mechanical properties, making it an ideal choice for designers of high-frequency circuits where performance consistency, signal integrity, and weight are paramount.
