|
| MOQ: | 1개 |
| 가격: | 0.99-99USD/PCS |
| 표준 포장: | 포장 |
| 배달 기간: | 2-10 영업일 |
| 지불 방법: | T/T, 페이팔 |
| 공급 능력: | 50000PCS |
F4BME245 Copper Clad Laminate: Premium Low-PIM Solution for High-Frequency Circuits
Taizhou Wangling presents the F4BME245, a high-performance PTFE glass fabric reinforced copper clad laminate engineered specifically for applications demanding exceptional passive intermodulation (PIM) performance. As a premium member of our F4BME series, this material combines superior electrical properties with advanced reverse treated copper foil technology to deliver unparalleled signal integrity in the most demanding RF and microwave environments.
Electrical Performance with Low-PIM Technology
The F4BME245 features a dielectric constant (Dk) of 2.45 ±0.05 at 10 GHz, providing stable and predictable electrical performance critical for controlled impedance designs. The dissipation factor (Df) is an exceptionally low 0.0012 at 10 GHz and 0.0017 at 20 GHz, ensuring minimal signal loss across broadband applications.
What truly distinguishes the F4BME245 is its outstanding PIM performance. With a PIM value of ≤ -159 dBc, this material is specifically optimized for applications where passive intermodulation distortion cannot be tolerated. The reverse treated copper foil (RTF) technology employed in F4BME series laminates provides:
The thermal coefficient of dielectric constant is -120 ppm/°C, ensuring stable operation across the full temperature range of -55°C to +260°C. Volume resistivity exceeds 6×10⁶ MΩ·cm, while surface resistivity is ≥1×10⁶ MΩ, providing robust insulation properties.
Thermal and Mechanical Excellence
F4BME245 demonstrates outstanding thermal stability with a CTE of 20-25 ppm/°C in the XY direction and 187 ppm/°C in the Z direction. This balanced expansion characteristics ensure reliable plated through-hole integrity even under severe thermal cycling conditions. Thermal conductivity of 0.30 W/(M·K) facilitates effective heat dissipation from active components.
The material withstands thermal stress testing at 260°C for 10 seconds over three cycles without delamination, confirming its compatibility with lead-free assembly processes. With moisture absorption of only ≤0.08%, the laminate maintains consistent electrical performance in varying environmental conditions. The UL 94 V-0 flammability rating ensures compliance with safety requirements.
F4BME Data Sheet
| Product Technical Parameters | Product Model & Data Sheet | |||||||||||
| Product Features | Test Conditions | Unit | F4BME217 | F4BME220 | F4BME233 | F4BME245 | F4BME255 | F4BME265 | F4BME275 | F4BME294 | F4BME300 | |
| Dielectric Constant (Typical) | 10GHz | / | 2.17 | 2.2 | 2.33 | 2.45 | 2.55 | 2.65 | 2.75 | 2.94 | 3.0 | |
| Dielectric Constant Tolerance | / | / | ±0.04 | ±0.04 | ±0.04 | ±0.05 | ±0.05 | ±0.05 | ±0.05 | ±0.06 | ±0.06 | |
| Loss Tangent (Typical) | 10GHz | / | 0.001 | 0.001 | 0.0011 | 0.0012 | 0.0013 | 0.0013 | 0.0015 | 0.0016 | 0.0017 | |
| 20GHz | / | 0.0014 | 0.0014 | 0.0015 | 0.0017 | 0.0018 | 0.0019 | 0.0021 | 0.0023 | 0.0025 | ||
| Dielectric Constant Temperature Coefficient | -55ºC～150ºC | PPM/℃ | -150 | -142 | -130 | -120 | -110 | -100 | -92 | -85 | -80 | |
| Peel Strength | 1 OZ F4BM | N/mm | >1.8 | >1.8 | >1.8 | >1.8 | >1.8 | >1.8 | >1.8 | >1.8 | >1.8 | |
| 1 OZ F4BME | N/mm | >1.6 | >1.6 | >1.6 | >1.6 | >1.6 | >1.6 | >1.6 | >1.6 | >1.6 | ||
| Volume Resistivity | Standard Condition | MΩ.cm | ≥6×10^6 | ≥6×10^6 | ≥6×10^6 | ≥6×10^6 | ≥6×10^6 | ≥6×10^6 | ≥6×10^6 | ≥6×10^6 | ≥6×10^6 | |
| Surface Resistivity | Standard Condition | MΩ | ≥1×10^6 | ≥1×10^6 | ≥1×10^6 | ≥1×10^6 | ≥1×10^6 | ≥1×10^6 | ≥1×10^6 | ≥1×10^6 | ≥1×10^6 | |
| Electrical Strength (Z direction) | 5KW,500V/s | KV/mm | >23 | >23 | >23 | >25 | >25 | >25 | >28 | >30 | >30 | |
| Breakdown Voltage (XY direction) | 5KW,500V/s | KV | >30 | >30 | >32 | >32 | >34 | >34 | >35 | >36 | >36 | |
| Coefficientof Thermal Expansion | XY direction | -55 º~288ºC | ppm/ºC | 2,534 | 2,534 | 2,230 | 2,025 | 1,621 | 1,417 | 1,416 | 1,215 | 1,215 |
| Z direction | -55 º~288ºC | ppm/ºC | 240 | 240 | 205 | 187 | 173 | 142 | 112 | 98 | 95 | |
| Thermal Stress | 260℃, 10s,3 times | No delamination | No delamination | No delamination | No delamination | No delamination | No delamination | No delamination | No delamination | No delamination | ||
| Water Absorption | 20±2℃, 24 hours | % | ≤0.08 | ≤0.08 | ≤0.08 | ≤0.08 | ≤0.08 | ≤0.08 | ≤0.08 | ≤0.08 | ≤0.08 | |
| Density | Room Temperature | g/cm3 | 2.17 | 2.18 | 2.20 | 2.22 | 2.25 | 2.25 | 2.28 | 2.29 | 2.29 | |
| Long-Term Operating Temperature | High-Low Temperature Chamber | ℃ | -55～+260 | -55～+260 | -55～+260 | -55～+260 | -55～+260 | -55～+260 | -55～+260 | -55～+260 | -55～+260 | |
| Thermal Conductivity | Z direction | W/(M.K) | 0.24 | 0.24 | 0.28 | 0.30 | 0.33 | 0.36 | 0.38 | 0.41 | 0.42 | |
| PIM | Only applicable to F4BME | dBc | ≤-159 | ≤-159 | ≤-159 | ≤-159 | ≤-159 | ≤-159 | ≤-159 | ≤-159 | ≤-159 | |
| Flammability | / | UL-94 | V-0 | V-0 | V-0 | V-0 | V-0 | V-0 | V-0 | V-0 | V-0 | |
| Material Composition | / | / | PTFE, Fiberglass Cloth F4BM paired with ED copper foil, F4BME paired with reverse-treated (RTF) copper foil. |
|||||||||
Processing and Production
Our state-of-the-art manufacturing facilities employ advanced PTFE processing technologies to ensure consistent quality and performance. The production process involves precision-controlled impregnation of glass fabric with PTFE resin, followed by high-temperature lamination with reverse treated copper foil under goes controlled conditions.
Processing Advantages:
Compatible with standard FR-4 fabrication processes
RTF copper enables finer line resolution and tighter impedance control
Excellent machinability for drilling, routing, and shearing
Resistant to all common etching chemicals and solvents
Supports both through-hole and surface-mount technologies
The reverse treated copper foil used in F4BME245 features a specially roughened surface on the bonding side, providing superior adhesion without compromising the smooth signal-carrying surface. This results in reduced conductor loss and improved signal integrity, particularly at higher frequencies.
Production Capacity and Supply Chain Capabilities
As a leading manufacturer of PTFE-based circuit materials, we maintain significant production capacity to serve customers ranging from prototype development to high-volume production:
Standard Panel Sizes:
460×610mm, 500×600mm, 850×1200mm, 914×1220mm, and 1000×1200mm
Custom dimensions available including 300×250mm, 350×380mm, 500×500mm, 840×840mm, and 1000×1500mm
Copper Foil Options:
0.5 oz (0.018mm) and 1 oz (0.035mm) reverse treated copper foil
Additional copper weights available upon request
Thickness Options:
Dielectric thicknesses from 0.1mm to 12.0mm
For Dk ≤ 2.65, minimum dielectric thickness is 0.1mm
For Dk 2.7-3.0, minimum dielectric thickness is 0.2mm
Please specify whether ordering by total thickness or dielectric thickness
Storage and Transportation Guidelines
To maintain the exceptional quality and performance characteristics of F4BME245, we adhere to stringent storage and handling protocols:
Storage Requirements:
Store in a clean, dry environment at 10°C to 35°C
Maintain relative humidity below 70%
Keep in original moisture-resistant packaging until use
Avoid exposure to direct sunlight, corrosive gases, and extreme temperature fluctuations
Recommended shelf life: 12 months under proper storage conditions
Transportation:
Laminates are packaged with protective interleaving materials
Moisture-barrier packaging protects against humidity during transit
Secure edge protection prevents damage and warpage
Multiple packaging configurations available for domestic and international shipping
Full compliance with international shipping regulations for electronic materials
Specialized Configurations
For applications requiring enhanced thermal management or electromagnetic shielding, F4BME245 is also available in metal-backed configurations:
F4BME245-AL: Aluminum-backed for lightweight heat dissipation
F4BME245-CU: Copper-backed for maximum thermal conductivity
Why Choose F4BME245?
The F4BME245 represents the ideal solution for engineers who cannot compromise on signal integrity. With its ultra-low PIM performance, exceptional electrical stability, and compatibility with standard fabrication processes, this material delivers the performance of premium PTFE laminates with the practical advantages of modern manufacturing.
Our commitment to quality, flexible production capacity, and reliable global supply chain ensure that you receive consistent, high-performance materials exactly when you need them. Contact us today to discuss how F4BME245 can meet your most demanding RF application requirements.
|
|
| MOQ: | 1개 |
| 가격: | 0.99-99USD/PCS |
| 표준 포장: | 포장 |
| 배달 기간: | 2-10 영업일 |
| 지불 방법: | T/T, 페이팔 |
| 공급 능력: | 50000PCS |
F4BME245 Copper Clad Laminate: Premium Low-PIM Solution for High-Frequency Circuits
Taizhou Wangling presents the F4BME245, a high-performance PTFE glass fabric reinforced copper clad laminate engineered specifically for applications demanding exceptional passive intermodulation (PIM) performance. As a premium member of our F4BME series, this material combines superior electrical properties with advanced reverse treated copper foil technology to deliver unparalleled signal integrity in the most demanding RF and microwave environments.
Electrical Performance with Low-PIM Technology
The F4BME245 features a dielectric constant (Dk) of 2.45 ±0.05 at 10 GHz, providing stable and predictable electrical performance critical for controlled impedance designs. The dissipation factor (Df) is an exceptionally low 0.0012 at 10 GHz and 0.0017 at 20 GHz, ensuring minimal signal loss across broadband applications.
What truly distinguishes the F4BME245 is its outstanding PIM performance. With a PIM value of ≤ -159 dBc, this material is specifically optimized for applications where passive intermodulation distortion cannot be tolerated. The reverse treated copper foil (RTF) technology employed in F4BME series laminates provides:
The thermal coefficient of dielectric constant is -120 ppm/°C, ensuring stable operation across the full temperature range of -55°C to +260°C. Volume resistivity exceeds 6×10⁶ MΩ·cm, while surface resistivity is ≥1×10⁶ MΩ, providing robust insulation properties.
Thermal and Mechanical Excellence
F4BME245 demonstrates outstanding thermal stability with a CTE of 20-25 ppm/°C in the XY direction and 187 ppm/°C in the Z direction. This balanced expansion characteristics ensure reliable plated through-hole integrity even under severe thermal cycling conditions. Thermal conductivity of 0.30 W/(M·K) facilitates effective heat dissipation from active components.
The material withstands thermal stress testing at 260°C for 10 seconds over three cycles without delamination, confirming its compatibility with lead-free assembly processes. With moisture absorption of only ≤0.08%, the laminate maintains consistent electrical performance in varying environmental conditions. The UL 94 V-0 flammability rating ensures compliance with safety requirements.
F4BME Data Sheet
| Product Technical Parameters | Product Model & Data Sheet | |||||||||||
| Product Features | Test Conditions | Unit | F4BME217 | F4BME220 | F4BME233 | F4BME245 | F4BME255 | F4BME265 | F4BME275 | F4BME294 | F4BME300 | |
| Dielectric Constant (Typical) | 10GHz | / | 2.17 | 2.2 | 2.33 | 2.45 | 2.55 | 2.65 | 2.75 | 2.94 | 3.0 | |
| Dielectric Constant Tolerance | / | / | ±0.04 | ±0.04 | ±0.04 | ±0.05 | ±0.05 | ±0.05 | ±0.05 | ±0.06 | ±0.06 | |
| Loss Tangent (Typical) | 10GHz | / | 0.001 | 0.001 | 0.0011 | 0.0012 | 0.0013 | 0.0013 | 0.0015 | 0.0016 | 0.0017 | |
| 20GHz | / | 0.0014 | 0.0014 | 0.0015 | 0.0017 | 0.0018 | 0.0019 | 0.0021 | 0.0023 | 0.0025 | ||
| Dielectric Constant Temperature Coefficient | -55ºC～150ºC | PPM/℃ | -150 | -142 | -130 | -120 | -110 | -100 | -92 | -85 | -80 | |
| Peel Strength | 1 OZ F4BM | N/mm | >1.8 | >1.8 | >1.8 | >1.8 | >1.8 | >1.8 | >1.8 | >1.8 | >1.8 | |
| 1 OZ F4BME | N/mm | >1.6 | >1.6 | >1.6 | >1.6 | >1.6 | >1.6 | >1.6 | >1.6 | >1.6 | ||
| Volume Resistivity | Standard Condition | MΩ.cm | ≥6×10^6 | ≥6×10^6 | ≥6×10^6 | ≥6×10^6 | ≥6×10^6 | ≥6×10^6 | ≥6×10^6 | ≥6×10^6 | ≥6×10^6 | |
| Surface Resistivity | Standard Condition | MΩ | ≥1×10^6 | ≥1×10^6 | ≥1×10^6 | ≥1×10^6 | ≥1×10^6 | ≥1×10^6 | ≥1×10^6 | ≥1×10^6 | ≥1×10^6 | |
| Electrical Strength (Z direction) | 5KW,500V/s | KV/mm | >23 | >23 | >23 | >25 | >25 | >25 | >28 | >30 | >30 | |
| Breakdown Voltage (XY direction) | 5KW,500V/s | KV | >30 | >30 | >32 | >32 | >34 | >34 | >35 | >36 | >36 | |
| Coefficientof Thermal Expansion | XY direction | -55 º~288ºC | ppm/ºC | 2,534 | 2,534 | 2,230 | 2,025 | 1,621 | 1,417 | 1,416 | 1,215 | 1,215 |
| Z direction | -55 º~288ºC | ppm/ºC | 240 | 240 | 205 | 187 | 173 | 142 | 112 | 98 | 95 | |
| Thermal Stress | 260℃, 10s,3 times | No delamination | No delamination | No delamination | No delamination | No delamination | No delamination | No delamination | No delamination | No delamination | ||
| Water Absorption | 20±2℃, 24 hours | % | ≤0.08 | ≤0.08 | ≤0.08 | ≤0.08 | ≤0.08 | ≤0.08 | ≤0.08 | ≤0.08 | ≤0.08 | |
| Density | Room Temperature | g/cm3 | 2.17 | 2.18 | 2.20 | 2.22 | 2.25 | 2.25 | 2.28 | 2.29 | 2.29 | |
| Long-Term Operating Temperature | High-Low Temperature Chamber | ℃ | -55～+260 | -55～+260 | -55～+260 | -55～+260 | -55～+260 | -55～+260 | -55～+260 | -55～+260 | -55～+260 | |
| Thermal Conductivity | Z direction | W/(M.K) | 0.24 | 0.24 | 0.28 | 0.30 | 0.33 | 0.36 | 0.38 | 0.41 | 0.42 | |
| PIM | Only applicable to F4BME | dBc | ≤-159 | ≤-159 | ≤-159 | ≤-159 | ≤-159 | ≤-159 | ≤-159 | ≤-159 | ≤-159 | |
| Flammability | / | UL-94 | V-0 | V-0 | V-0 | V-0 | V-0 | V-0 | V-0 | V-0 | V-0 | |
| Material Composition | / | / | PTFE, Fiberglass Cloth F4BM paired with ED copper foil, F4BME paired with reverse-treated (RTF) copper foil. |
|||||||||
Processing and Production
Our state-of-the-art manufacturing facilities employ advanced PTFE processing technologies to ensure consistent quality and performance. The production process involves precision-controlled impregnation of glass fabric with PTFE resin, followed by high-temperature lamination with reverse treated copper foil under goes controlled conditions.
Processing Advantages:
Compatible with standard FR-4 fabrication processes
RTF copper enables finer line resolution and tighter impedance control
Excellent machinability for drilling, routing, and shearing
Resistant to all common etching chemicals and solvents
Supports both through-hole and surface-mount technologies
The reverse treated copper foil used in F4BME245 features a specially roughened surface on the bonding side, providing superior adhesion without compromising the smooth signal-carrying surface. This results in reduced conductor loss and improved signal integrity, particularly at higher frequencies.
Production Capacity and Supply Chain Capabilities
As a leading manufacturer of PTFE-based circuit materials, we maintain significant production capacity to serve customers ranging from prototype development to high-volume production:
Standard Panel Sizes:
460×610mm, 500×600mm, 850×1200mm, 914×1220mm, and 1000×1200mm
Custom dimensions available including 300×250mm, 350×380mm, 500×500mm, 840×840mm, and 1000×1500mm
Copper Foil Options:
0.5 oz (0.018mm) and 1 oz (0.035mm) reverse treated copper foil
Additional copper weights available upon request
Thickness Options:
Dielectric thicknesses from 0.1mm to 12.0mm
For Dk ≤ 2.65, minimum dielectric thickness is 0.1mm
For Dk 2.7-3.0, minimum dielectric thickness is 0.2mm
Please specify whether ordering by total thickness or dielectric thickness
Storage and Transportation Guidelines
To maintain the exceptional quality and performance characteristics of F4BME245, we adhere to stringent storage and handling protocols:
Storage Requirements:
Store in a clean, dry environment at 10°C to 35°C
Maintain relative humidity below 70%
Keep in original moisture-resistant packaging until use
Avoid exposure to direct sunlight, corrosive gases, and extreme temperature fluctuations
Recommended shelf life: 12 months under proper storage conditions
Transportation:
Laminates are packaged with protective interleaving materials
Moisture-barrier packaging protects against humidity during transit
Secure edge protection prevents damage and warpage
Multiple packaging configurations available for domestic and international shipping
Full compliance with international shipping regulations for electronic materials
Specialized Configurations
For applications requiring enhanced thermal management or electromagnetic shielding, F4BME245 is also available in metal-backed configurations:
F4BME245-AL: Aluminum-backed for lightweight heat dissipation
F4BME245-CU: Copper-backed for maximum thermal conductivity
Why Choose F4BME245?
The F4BME245 represents the ideal solution for engineers who cannot compromise on signal integrity. With its ultra-low PIM performance, exceptional electrical stability, and compatibility with standard fabrication processes, this material delivers the performance of premium PTFE laminates with the practical advantages of modern manufacturing.
Our commitment to quality, flexible production capacity, and reliable global supply chain ensure that you receive consistent, high-performance materials exactly when you need them. Contact us today to discuss how F4BME245 can meet your most demanding RF application requirements.
