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| MOQ: | 1PCS |
| 가격: | 2.99USD/pcs |
| 표준 포장: | 포장 |
| 배달 기간: | 8 영업일 |
| 지불 방법: | T/T, 페이팔 |
| 공급 능력: | 50000PCS |
2-Layer TLX-9 PCB | 10mil Core | EPIG (Nickel-Free) Finish
Product Overview
We are pleased to present this newly customized 2-layer rigid PCB built on Taconic TLX-9 high-performance PTFE/woven glass laminate. Engineered for demanding RF and microwave applications, TLX-9 offers exceptionally well-controlled electrical and mechanical properties, including a low and stable dielectric constant of 2.50 and an ultra-low dissipation factor of 0.0019 at 10 GHz.
The board measures 91.6mm x 45.3mm (single piece) with a finished thickness of 0.3mm (including 10mil core + 2 x 35μm copper) and dimensional tolerance of ±0.15mm. Minimum trace and space are 5/6 mils, with a minimum finished hole size of 0.3mm. No blind vias are used in this construction.
This design features no solder mask and no silkscreen on both sides—an intentional choice to eliminate parasitic losses and ensure optimal RF performance. The EPIG (Electroless Palladium Immersion Gold), Nickel-free surface finish provides excellent solderability, ultra-flat surface for fine-pitch components, and superior corrosion resistance. Unlike standard ENIG, the nickel-free EPIG eliminates magnetic concerns and is ideal for high-frequency applications where signal integrity is critical. Every board undergoes 100% electrical testing prior to shipment and conforms to IPC-Class-2 quality standards. Gerber files are supplied in RS-274-X format, and worldwide shipping is available.
PCB General Specifications
| Parameter | Detail |
| Layer Count | 2-Layer Rigid |
| Base Material | Taconic TLX-9 (PTFE/woven glass composite) |
| Board Dimensions | 91.6mm x 45.3mm (1 PCB) ±0.15mm |
| Finished Thickness | 0.3mm |
| Core Thickness | 10mil (0.254mm) |
| Min. Trace / Space | 5 / 6 mils |
| Min. Hole Size | 0.3mm |
| Blind Vias | None |
| Finished Cu Weight | 1 oz (1.4 mils / 35μm) outer layers |
| Via Plating Thickness | 20 μm |
| Surface Finish | EPIG (Electroless Palladium Immersion Gold), Nickel-free |
| Top Solder Mask | None |
| Bottom Solder Mask | None |
| Top Silkscreen | None |
| Bottom Silkscreen | None |
| Electrical Test | 100% prior to shipment |
| Artwork Format | Gerber RS-274-X |
| Quality Standard | IPC-Class-2 |
| Availability | Worldwide |
| Components / Pads / Vias / Nets | 29 / 45 / 19 / 2 |
Material Advantages: Taconic TLX-9
Taconic has over 35 years of experience coating fiberglass fabric with PTFE (polytetrafluoroethylene), enabling the manufacture of copper-clad PTFE/woven glass laminates with exceptionally well-controlled electrical and mechanical properties. TLX-9 is a member of the TLX series, which offers a dielectric constant range of 2.45 to 2.65, with TLX-9 specified at 2.50 ±0.04.
Key material highlights:
Low and stable dielectric constant (2.50 ±0.04) – tightly controlled across a broad frequency range and temperature spectrum
Ultra-low dissipation factor (0.0019 at 10 GHz) – minimizes signal loss at high frequencies
Virtually no moisture absorption (<0.02%) – maintains stable electrical properties during fabrication and in humid environments
Excellent dimensional stability – supports precise circuit fabrication
UL 94 V-0 flammability rating – meets stringent fire safety standards
High dielectric breakdown (>60 kV) – robust voltage withstand capability
TLX-9 laminates can be sheared, drilled, milled, and plated using standard methods for PTFE/woven fiberglass materials. They are tested in accordance with IPC-TM 650, and a Certificate of Compliance containing actual test data accompanies each shipment.
TLX-9 Material Properties
| Property | Test Method | Value | Benefit |
| Dielectric Constant @ 10 GHz | IPC-TM 650 2.5.5.5 | 2.50 ±0.04 | Low, stable Dk for consistent RF performance |
| Dissipation Factor @ 10 GHz | IPC-TM 650 2.5.5.5 | 0.0019 | Ultra-low loss at microwave frequencies |
| Moisture Absorption | IPC-TM 650 2.6.2.1 | <0.02% | Stable in humid environments |
| Dielectric Breakdown | IPC-TM 650 2.5.6 | >60 kV | High voltage withstand capability |
| Volume Resistivity | IPC-TM 650 2.5.17.1 | 10⁷ MΩ·cm | Good insulation resistance |
| Surface Resistivity | IPC-TM 650 2.5.17.1 | 10⁷ MΩ | Clean signal integrity |
| Arc Resistance | IPC-TM 650 2.5.1 | >180 seconds | Excellent arc withstand |
| Flexural Strength (Lengthwise) | IPC-TM 650 2.4.4 | >23,000 lbs/in (>159 N/mm²) | Robust mechanical strength |
| Flexural Strength (Crosswise) | IPC-TM 650 2.4.4 | >19,000 lbs/in (>131 N/mm²) | Balanced mechanical properties |
| Peel Strength (1 oz copper) | IPC-TM 650 2.4.8 | 2.1 N/mm (12.0 lbs/linear in) | Reliable copper adhesion |
| Thermal Conductivity | ASTM F 433 | 0.19 W/(m·K) | Basic heat dissipation |
| CTE (X-Y axis) | ASTM D 3386 (TMA) | 9-12 ppm/°C | Excellent dimensional stability |
| CTE (Z axis) | ASTM D 3386 (TMA) | 130-145 ppm/°C | Reliable PTH performance |
| Flammability Rating | UL 94 | V-0 | Fire safety compliant |
PCB Stackup & Construction
The board features a thin, high-performance 2-layer stackup:
Top Copper (Layer 1): 1 oz (35μm) – Electrodeposited copper
Dielectric Core: Taconic TLX-9 – 10mil (0.254mm)
Bottom Copper (Layer 2): 1 oz (35μm) – Electrodeposited copper
Total Finished Thickness: 0.3mm
Minimum trace and space are 5/6 mils, with a minimum finished hole size of 0.3mm. Via plating thickness is 20μm, and no blind vias are used. The design supports 29 components, 45 total pads (24 thru-hole, 21 top SMT), 19 vias, and 2 nets.
Both solder mask and silkscreen are omitted on both sides, preserving the bare dielectric surface for optimal RF performance and minimizing signal loss—critical for high-frequency microwave applications.
Surface Finish: EPIG (Nickel-Free)
The EPIG (Electroless Palladium Immersion Gold), Nickel-free finish offers distinct advantages over traditional ENIG for high-frequency applications:
| Advantage | Description |
| Nickel-free | Eliminates magnetic properties that can affect signal integrity |
| Ultra-flat surface | Ideal for fine-pitch components and wire bonding |
| Excellent solderability | Consistent, repeatable solder joints |
| Corrosion resistant | Long shelf life and environmental protection |
| High-frequency optimized | Minimal skin effect losses compared to nickel-based finishes |
Typical Applications
LNAs, LNBs, and LNCs (Low Noise Amplifiers/Blocks/Converters)
PCS/PCN large format antennas
High power amplifiers
Passive components (couplers, filters, power dividers)
Radar systems and phased array antennas
Mobile communication systems
Microwave test equipment and transmission devices
Available Configurations
TLX-9 laminates are available with standard dielectric thicknesses ranging from 0.005" to >0.031" (0.13mm to >0.78mm). Copper cladding options include ½ oz. (CH), 1 oz. (C1), and 2 oz. (C2) electrodeposited copper. Standard panel sizes include 12"x18", 16"x18", 18"x24", 16"x36", 24"x36", and 18"x48" (304mm x 457mm to 457mm x 1220mm), with additional sizes available upon request.
All PCBs are 100% electrically tested and shipped with a Certificate of Conformance per IPC-6012. For Gerber review, stackup confirmation, or volume pricing, please contact our technical sales team.
|
|
| MOQ: | 1PCS |
| 가격: | 2.99USD/pcs |
| 표준 포장: | 포장 |
| 배달 기간: | 8 영업일 |
| 지불 방법: | T/T, 페이팔 |
| 공급 능력: | 50000PCS |
2-Layer TLX-9 PCB | 10mil Core | EPIG (Nickel-Free) Finish
Product Overview
We are pleased to present this newly customized 2-layer rigid PCB built on Taconic TLX-9 high-performance PTFE/woven glass laminate. Engineered for demanding RF and microwave applications, TLX-9 offers exceptionally well-controlled electrical and mechanical properties, including a low and stable dielectric constant of 2.50 and an ultra-low dissipation factor of 0.0019 at 10 GHz.
The board measures 91.6mm x 45.3mm (single piece) with a finished thickness of 0.3mm (including 10mil core + 2 x 35μm copper) and dimensional tolerance of ±0.15mm. Minimum trace and space are 5/6 mils, with a minimum finished hole size of 0.3mm. No blind vias are used in this construction.
This design features no solder mask and no silkscreen on both sides—an intentional choice to eliminate parasitic losses and ensure optimal RF performance. The EPIG (Electroless Palladium Immersion Gold), Nickel-free surface finish provides excellent solderability, ultra-flat surface for fine-pitch components, and superior corrosion resistance. Unlike standard ENIG, the nickel-free EPIG eliminates magnetic concerns and is ideal for high-frequency applications where signal integrity is critical. Every board undergoes 100% electrical testing prior to shipment and conforms to IPC-Class-2 quality standards. Gerber files are supplied in RS-274-X format, and worldwide shipping is available.
PCB General Specifications
| Parameter | Detail |
| Layer Count | 2-Layer Rigid |
| Base Material | Taconic TLX-9 (PTFE/woven glass composite) |
| Board Dimensions | 91.6mm x 45.3mm (1 PCB) ±0.15mm |
| Finished Thickness | 0.3mm |
| Core Thickness | 10mil (0.254mm) |
| Min. Trace / Space | 5 / 6 mils |
| Min. Hole Size | 0.3mm |
| Blind Vias | None |
| Finished Cu Weight | 1 oz (1.4 mils / 35μm) outer layers |
| Via Plating Thickness | 20 μm |
| Surface Finish | EPIG (Electroless Palladium Immersion Gold), Nickel-free |
| Top Solder Mask | None |
| Bottom Solder Mask | None |
| Top Silkscreen | None |
| Bottom Silkscreen | None |
| Electrical Test | 100% prior to shipment |
| Artwork Format | Gerber RS-274-X |
| Quality Standard | IPC-Class-2 |
| Availability | Worldwide |
| Components / Pads / Vias / Nets | 29 / 45 / 19 / 2 |
Material Advantages: Taconic TLX-9
Taconic has over 35 years of experience coating fiberglass fabric with PTFE (polytetrafluoroethylene), enabling the manufacture of copper-clad PTFE/woven glass laminates with exceptionally well-controlled electrical and mechanical properties. TLX-9 is a member of the TLX series, which offers a dielectric constant range of 2.45 to 2.65, with TLX-9 specified at 2.50 ±0.04.
Key material highlights:
Low and stable dielectric constant (2.50 ±0.04) – tightly controlled across a broad frequency range and temperature spectrum
Ultra-low dissipation factor (0.0019 at 10 GHz) – minimizes signal loss at high frequencies
Virtually no moisture absorption (<0.02%) – maintains stable electrical properties during fabrication and in humid environments
Excellent dimensional stability – supports precise circuit fabrication
UL 94 V-0 flammability rating – meets stringent fire safety standards
High dielectric breakdown (>60 kV) – robust voltage withstand capability
TLX-9 laminates can be sheared, drilled, milled, and plated using standard methods for PTFE/woven fiberglass materials. They are tested in accordance with IPC-TM 650, and a Certificate of Compliance containing actual test data accompanies each shipment.
TLX-9 Material Properties
| Property | Test Method | Value | Benefit |
| Dielectric Constant @ 10 GHz | IPC-TM 650 2.5.5.5 | 2.50 ±0.04 | Low, stable Dk for consistent RF performance |
| Dissipation Factor @ 10 GHz | IPC-TM 650 2.5.5.5 | 0.0019 | Ultra-low loss at microwave frequencies |
| Moisture Absorption | IPC-TM 650 2.6.2.1 | <0.02% | Stable in humid environments |
| Dielectric Breakdown | IPC-TM 650 2.5.6 | >60 kV | High voltage withstand capability |
| Volume Resistivity | IPC-TM 650 2.5.17.1 | 10⁷ MΩ·cm | Good insulation resistance |
| Surface Resistivity | IPC-TM 650 2.5.17.1 | 10⁷ MΩ | Clean signal integrity |
| Arc Resistance | IPC-TM 650 2.5.1 | >180 seconds | Excellent arc withstand |
| Flexural Strength (Lengthwise) | IPC-TM 650 2.4.4 | >23,000 lbs/in (>159 N/mm²) | Robust mechanical strength |
| Flexural Strength (Crosswise) | IPC-TM 650 2.4.4 | >19,000 lbs/in (>131 N/mm²) | Balanced mechanical properties |
| Peel Strength (1 oz copper) | IPC-TM 650 2.4.8 | 2.1 N/mm (12.0 lbs/linear in) | Reliable copper adhesion |
| Thermal Conductivity | ASTM F 433 | 0.19 W/(m·K) | Basic heat dissipation |
| CTE (X-Y axis) | ASTM D 3386 (TMA) | 9-12 ppm/°C | Excellent dimensional stability |
| CTE (Z axis) | ASTM D 3386 (TMA) | 130-145 ppm/°C | Reliable PTH performance |
| Flammability Rating | UL 94 | V-0 | Fire safety compliant |
PCB Stackup & Construction
The board features a thin, high-performance 2-layer stackup:
Top Copper (Layer 1): 1 oz (35μm) – Electrodeposited copper
Dielectric Core: Taconic TLX-9 – 10mil (0.254mm)
Bottom Copper (Layer 2): 1 oz (35μm) – Electrodeposited copper
Total Finished Thickness: 0.3mm
Minimum trace and space are 5/6 mils, with a minimum finished hole size of 0.3mm. Via plating thickness is 20μm, and no blind vias are used. The design supports 29 components, 45 total pads (24 thru-hole, 21 top SMT), 19 vias, and 2 nets.
Both solder mask and silkscreen are omitted on both sides, preserving the bare dielectric surface for optimal RF performance and minimizing signal loss—critical for high-frequency microwave applications.
Surface Finish: EPIG (Nickel-Free)
The EPIG (Electroless Palladium Immersion Gold), Nickel-free finish offers distinct advantages over traditional ENIG for high-frequency applications:
| Advantage | Description |
| Nickel-free | Eliminates magnetic properties that can affect signal integrity |
| Ultra-flat surface | Ideal for fine-pitch components and wire bonding |
| Excellent solderability | Consistent, repeatable solder joints |
| Corrosion resistant | Long shelf life and environmental protection |
| High-frequency optimized | Minimal skin effect losses compared to nickel-based finishes |
Typical Applications
LNAs, LNBs, and LNCs (Low Noise Amplifiers/Blocks/Converters)
PCS/PCN large format antennas
High power amplifiers
Passive components (couplers, filters, power dividers)
Radar systems and phased array antennas
Mobile communication systems
Microwave test equipment and transmission devices
Available Configurations
TLX-9 laminates are available with standard dielectric thicknesses ranging from 0.005" to >0.031" (0.13mm to >0.78mm). Copper cladding options include ½ oz. (CH), 1 oz. (C1), and 2 oz. (C2) electrodeposited copper. Standard panel sizes include 12"x18", 16"x18", 18"x24", 16"x36", 24"x36", and 18"x48" (304mm x 457mm to 457mm x 1220mm), with additional sizes available upon request.
All PCBs are 100% electrically tested and shipped with a Certificate of Conformance per IPC-6012. For Gerber review, stackup confirmation, or volume pricing, please contact our technical sales team.
