|
| MOQ: | 1PCS |
| 가격: | 0.99-99USD/PCS |
| 표준 포장: | 포장 |
| 배달 기간: | 2-10 영업일 |
| 지불 방법: | T/T, 페이팔 |
| 공급 능력: | 50000PCS |
Precision RF PCB Solution Based on WL-CT300: High-Frequency Performance with FR4-Like Processability
For designers working on RF, microwave, and aerospace applications, material selection is a constant trade-off between electrical performance and manufacturability. Traditional PTFE-based laminates offer low loss but introduce challenges in dimensional stability, multilayer processing, and consistency. The WL-CT300 from Taizhou Wangling Insulating Materials Factory closes this gap—combining thermosetting hydrocarbon-ceramic resin with woven fiberglass to deliver exceptional high-frequency characteristics alongside FR4-compatible PCB fabrication processes.
We are now offering a custom 2-layer rigid PCB built on WL-CT300, engineered for compact, high-reliability RF and high-frequency circuits.
1. WL-CT300 Laminate: Key Properties
The WL-CT300 laminate is composed of hydrocarbon resin, ceramic, and fiberglass cloth, forming a thermosetting resin system. Unlike PTFE-based materials, this laminate can be processed using standard FR4 fabrication techniques, which ensures better circuit stability and consistency.
Key properties are summarized in the table below.
| Property Category | Parameter | Value / Description |
| Material Composition | Resin System | Hydrocarbon + ceramic + fiberglass cloth |
| Halogen Content | Halogenated | |
| Copper Foil Types | ED copper, RTF copper (reverse treated) | |
| Product Variants | WL-CT300 (standard), WL-CTxxx-AL (aluminum-backed) | |
| Electrical Properties | Dielectric Constant (Typical) @ 10 GHz | 3 |
| Dielectric Constant (Design) @ 10 GHz | 2.98 | |
| Dk Tolerance | ±0.05 | |
| Dissipation Factor @ 2 GHz | 0.0025 | |
| Dissipation Factor @ 10 GHz | 0.003 | |
| Dissipation Factor @ 20 GHz | 0.0036 | |
| TCDk (-55°C ~ 150°C) | 27 ppm/°C | |
| Volume Resistivity (Normal State) | 3×10⁸ MΩ·cm | |
| Surface Resistivity (Normal State) | 2×10⁸ MΩ | |
| Dielectric Strength (Z-direction) | 28 KV/mm | |
| Breakdown Voltage (XY-direction) | 35 KV | |
| PIM Value (with RTF copper) | ≤ -158 dBc | |
| Mechanical Properties | Density | 1.57 g/cm³ |
| Peel Strength (1oz RTF copper, normal) | 0.85 N/mm | |
| Peel Strength (1oz RTF copper, after humidity) | 0.72 N/mm | |
| CTE (X-direction, -55°C~288°C) | 15 ppm/°C | |
| CTE (Y-direction, -55°C~288°C) | 14 ppm/°C | |
| CTE (Z-direction, -55°C~288°C) | 31 ppm/°C | |
| Thermal Properties | Glass Transition Temperature (Tg) | > 280°C |
| Decomposition Temperature (Td) | 412°C | |
| Long-Term Operating Temperature | -55°C to +260°C | |
| Thermal Conductivity (Z-direction) | 0.41 W/(m·K) | |
| Thermal Stress (288°C, 10s, 3 cycles) | No delamination | |
| Other Properties | Water Absorption (24h, 20±2°C) | 0.15% |
| Flammability Rating (UL-94) | V-0 | |
| Radiation Resistance | Excellent (stable after irradiation) | |
| Outgassing | Low (meets aerospace vacuum requirements) | |
| Available Dimensions | Standard Panel Sizes | 460×610 mm (18×24"), 915×1220 mm (36×48") |
| Minimum Core Thickness | 0.127 mm (5 mil) | |
| Thickness Increments | Multiples of 0.127 mm (5 mil) | |
| Maximum Thickness (standard) | 3.05 mm (thicker available on request) | |
| Standard Copper Weights | 0.5 oz (0.018 mm), 1 oz (0.035 mm) |
Note on RTF Copper: When RTF (reverse treated) copper foil is specified, an additional 0.018 mm (0.7 mil) is added to the dielectric thickness due to the adhesive backing. RTF copper offers excellent PIM performance, reduced conductor loss, and lower insertion loss.
General Note: All data are provided as typical values. Measurements are performed using GB/T 12636-1990 or IPC-TM650 2.5.5.5 (stripline method) for Dk/Df. Design values are measured using the 50Ω microstrip line method. Other properties are tested per IPC-TM-650 or GBT4722-2017. The information is intended for material selection reference only and should not be construed as a warranty. Customers are advised to verify suitability for each intended application.
2. Ordering Requirements for WL-CT300 Laminate
To ensure accurate fulfillment, the following information is required to be specified when an order is placed:
| Ordering Item | Required Specification |
| Product Type | WL-CT300 (standard) or WL-CTxxx-AL (aluminum-backed) |
| Dielectric Constant (Dk) | 3.00 (other values available: 3.30, 3.38, 3.48, 4.10, 6.15) |
| Dielectric Thickness | Numerical value (e.g., 0.127 mm / 5 mil) |
| Copper Foil Type | ED copper or RTF copper |
| Copper Foil Thickness | 0.5 oz (0.018 mm) / 1 oz (0.035 mm) / other (specify) |
| Panel Size | 460×610 mm / 915×1220 mm / other (specify) |
| Quantity | Number of panels or pieces |
Standard Dielectric Thicknesses and Tolerances (WL-CT300):
| With ED Copper | With RTF Copper | ||
| Thickness (mm) | Tolerance (mm) | Thickness (mm) | Tolerance (mm) |
| 0.127 (5.0 mil) | ±0.012 (0.5 mil) | 0.272 (10.7 mil) | ±0.025 (1.0 mil) |
| 0.254 (10 mil) | ±0.025 (1.0 mil) | 0.526 (20.7 mil) | ±0.038 (1.5 mil) |
| 0.508 (20 mil) | ±0.038 (1.5 mil) | 0.780 (30.7 mil) | ±0.051 (2.0 mil) |
| 0.762 (30 mil) | ±0.050 (2.0 mil) | 1.034 (40.7 mil) | ±0.076 (3.0 mil) |
| 1.016 (40 mil) | ±0.076 (3.0 mil) | 1.542 (60.7 mil) | ±0.100 (4.0 mil) |
| 1.524 (60 mil) | ±0.100 (4.0 mil) | 2.050 (80.7 mil) | ±0.127 (5.0 mil) |
Aluminum-Backed Version (WL-CTxxx-AL):
| Parameter | Specification |
| Metal Base | Aluminum |
| Density | 2.7 g/cm³ |
| Thermal Conductivity | 180 W/(m·K) |
| CTE | 24 ppm/°C |
| Available Aluminum Thicknesses | 0.48, 0.98, 1.48, 1.98, 2.98, 3.98 mm |
| Aluminum Thickness Tolerance | +0.02 / -0.05 mm |
| Available Panel Sizes | 460×610 mm, 460×305 mm |
3. Custom PCB Specifications (Based on WL-CT300)
The following 2-layer rigid PCB has been designed and manufactured using WL-CT300 as the core material.
Construction Details
| Parameter | Specification |
| Layer count | 2 layers |
| Base material | WL-CT300 |
| Finished board thickness | 0.25 mm |
| Stackup | 35 μm Cu + 0.127 mm WL-CT300 core + 35 μm Cu |
| Finished outer Cu weight | 1 oz (35 μm) |
| Via plating thickness | 20 μm |
| Min trace/space | 4/5 mil |
| Min hole size | 0.25 mm |
| Blind vias | None |
| Board dimensions | 66.04 mm × 43.18 mm per piece, tolerance ±0.15 mm |
| Surface finish | Pure Gold Plating |
| Solder mask (both sides) | Not applied |
| Top silkscreen | Black |
| Bottom silkscreen | Not applied |
| Electrical test | 100% performed prior to shipment |
4. Key Advantages of WL-CT300 vs. PTFE-Based Laminates
| Feature | WL-CT300 (Hydrocarbon Ceramic) | Traditional PTFE Laminates |
| PCB Processability | FR4-like (standard processes) | Specialized processes required |
| Circuit Stability | Excellent (thermosetting) | Moderate (thermoplastic) |
| Tg | >280°C | ~230°C (typical) |
| Z-axis CTE | 31 ppm/°C (low) | Higher (typical) |
| Thermal Conductivity | 0.41 W/(m·K) | ~0.3 W/(m·K) |
| Multi-layer Capability | Excellent (multiple press cycles) | Limited |
| Dense Hole & Fine Line Processing | Excellent | More challenging |
5. Frequency and Temperature Stability Characteristics
The WL-CT300 material exhibits excellent frequency and temperature stability, as summarized below:
| Characteristic | Performance |
| Frequency Stability (0.5–25 GHz) | Stable Dk and low loss across the entire frequency range |
| Temperature Stability (-55°C to +150°C) | TCDK of approximately 27 ppm/°C (minimal variation) |
| Usable Temperature Range | Exceeds -55°C to +150°C (practical operating range: -55°C to +260°C) |
6. Applications – Where This PCB Excels
Based on Wangling’s typical applications for WL-CT300, this 0.25 mm thin, 2-layer PCB is well-suited for:
Small form-factor satellite communication modules (low outgassing, radiation tolerant)
Phased-array antenna feed boards (tight εr tolerance ±0.05, stable phase over temp)
Power amplifiers (high Tg, thermal conductivity >0.4 W/m·K)
Automotive radar sensors (compact size, consistent Df up to 24 GHz)
Avionics and space-cabin equipment (vacuum stability, mechanical robustness)
The absence of solder mask also supports high-voltage or corona-sensitive designs where bare dielectric clearance is preferred.
7. Why This WL-CT300-Based PCB Solution Should Be Considered
Superior processability is offered: FR4-like fabrication is enabled, reducing manufacturing complexity and cost compared to PTFE materials.
Excellent electrical performance is achieved: Low loss (Df 0.0025–0.0036) and a stable Dk (3.00 ±0.05) are provided across 0.5–25 GHz.
High thermal reliability is ensured: Continuous operation from -55°C to +260°C is supported, with Tg >280°C and Td of 412°C.
Excellent dimensional stability is delivered: CTE in X/Y (15/14 ppm/°C) is matched to copper, while low Z-axis CTE (31 ppm/°C) ensures plated through-hole reliability.
High thermal conductivity is provided: 0.41 W/(m·K) is offered, which is superior to comparable thermoplastic materials for high-power applications.
Space-grade reliability is demonstrated: Radiation resistance and low outgassing properties are exhibited, meeting aerospace requirements.
High-volume, cost-effective production is available: The material is designed for commercial, high-volume applications with excellent value.
PIM performance is optimized: When paired with RTF copper, PIM values of ≤-158 dBc are achieved, reducing passive intermodulation.
Conclusion
Wangling's WL-CT300 hydrocarbon ceramic laminate, combined with the custom 2-layer PCB design described above, can be regarded as a reliable, low-loss, and highly manufacturable solution for demanding microwave, automotive radar, aerospace, and communication systems. The ability to process this material using standard FR4 techniques provides a significant advantage over PTFE-based alternatives, enabling faster turnaround times, lower costs, and more consistent results.
|
|
| MOQ: | 1PCS |
| 가격: | 0.99-99USD/PCS |
| 표준 포장: | 포장 |
| 배달 기간: | 2-10 영업일 |
| 지불 방법: | T/T, 페이팔 |
| 공급 능력: | 50000PCS |
Precision RF PCB Solution Based on WL-CT300: High-Frequency Performance with FR4-Like Processability
For designers working on RF, microwave, and aerospace applications, material selection is a constant trade-off between electrical performance and manufacturability. Traditional PTFE-based laminates offer low loss but introduce challenges in dimensional stability, multilayer processing, and consistency. The WL-CT300 from Taizhou Wangling Insulating Materials Factory closes this gap—combining thermosetting hydrocarbon-ceramic resin with woven fiberglass to deliver exceptional high-frequency characteristics alongside FR4-compatible PCB fabrication processes.
We are now offering a custom 2-layer rigid PCB built on WL-CT300, engineered for compact, high-reliability RF and high-frequency circuits.
1. WL-CT300 Laminate: Key Properties
The WL-CT300 laminate is composed of hydrocarbon resin, ceramic, and fiberglass cloth, forming a thermosetting resin system. Unlike PTFE-based materials, this laminate can be processed using standard FR4 fabrication techniques, which ensures better circuit stability and consistency.
Key properties are summarized in the table below.
| Property Category | Parameter | Value / Description |
| Material Composition | Resin System | Hydrocarbon + ceramic + fiberglass cloth |
| Halogen Content | Halogenated | |
| Copper Foil Types | ED copper, RTF copper (reverse treated) | |
| Product Variants | WL-CT300 (standard), WL-CTxxx-AL (aluminum-backed) | |
| Electrical Properties | Dielectric Constant (Typical) @ 10 GHz | 3 |
| Dielectric Constant (Design) @ 10 GHz | 2.98 | |
| Dk Tolerance | ±0.05 | |
| Dissipation Factor @ 2 GHz | 0.0025 | |
| Dissipation Factor @ 10 GHz | 0.003 | |
| Dissipation Factor @ 20 GHz | 0.0036 | |
| TCDk (-55°C ~ 150°C) | 27 ppm/°C | |
| Volume Resistivity (Normal State) | 3×10⁸ MΩ·cm | |
| Surface Resistivity (Normal State) | 2×10⁸ MΩ | |
| Dielectric Strength (Z-direction) | 28 KV/mm | |
| Breakdown Voltage (XY-direction) | 35 KV | |
| PIM Value (with RTF copper) | ≤ -158 dBc | |
| Mechanical Properties | Density | 1.57 g/cm³ |
| Peel Strength (1oz RTF copper, normal) | 0.85 N/mm | |
| Peel Strength (1oz RTF copper, after humidity) | 0.72 N/mm | |
| CTE (X-direction, -55°C~288°C) | 15 ppm/°C | |
| CTE (Y-direction, -55°C~288°C) | 14 ppm/°C | |
| CTE (Z-direction, -55°C~288°C) | 31 ppm/°C | |
| Thermal Properties | Glass Transition Temperature (Tg) | > 280°C |
| Decomposition Temperature (Td) | 412°C | |
| Long-Term Operating Temperature | -55°C to +260°C | |
| Thermal Conductivity (Z-direction) | 0.41 W/(m·K) | |
| Thermal Stress (288°C, 10s, 3 cycles) | No delamination | |
| Other Properties | Water Absorption (24h, 20±2°C) | 0.15% |
| Flammability Rating (UL-94) | V-0 | |
| Radiation Resistance | Excellent (stable after irradiation) | |
| Outgassing | Low (meets aerospace vacuum requirements) | |
| Available Dimensions | Standard Panel Sizes | 460×610 mm (18×24"), 915×1220 mm (36×48") |
| Minimum Core Thickness | 0.127 mm (5 mil) | |
| Thickness Increments | Multiples of 0.127 mm (5 mil) | |
| Maximum Thickness (standard) | 3.05 mm (thicker available on request) | |
| Standard Copper Weights | 0.5 oz (0.018 mm), 1 oz (0.035 mm) |
Note on RTF Copper: When RTF (reverse treated) copper foil is specified, an additional 0.018 mm (0.7 mil) is added to the dielectric thickness due to the adhesive backing. RTF copper offers excellent PIM performance, reduced conductor loss, and lower insertion loss.
General Note: All data are provided as typical values. Measurements are performed using GB/T 12636-1990 or IPC-TM650 2.5.5.5 (stripline method) for Dk/Df. Design values are measured using the 50Ω microstrip line method. Other properties are tested per IPC-TM-650 or GBT4722-2017. The information is intended for material selection reference only and should not be construed as a warranty. Customers are advised to verify suitability for each intended application.
2. Ordering Requirements for WL-CT300 Laminate
To ensure accurate fulfillment, the following information is required to be specified when an order is placed:
| Ordering Item | Required Specification |
| Product Type | WL-CT300 (standard) or WL-CTxxx-AL (aluminum-backed) |
| Dielectric Constant (Dk) | 3.00 (other values available: 3.30, 3.38, 3.48, 4.10, 6.15) |
| Dielectric Thickness | Numerical value (e.g., 0.127 mm / 5 mil) |
| Copper Foil Type | ED copper or RTF copper |
| Copper Foil Thickness | 0.5 oz (0.018 mm) / 1 oz (0.035 mm) / other (specify) |
| Panel Size | 460×610 mm / 915×1220 mm / other (specify) |
| Quantity | Number of panels or pieces |
Standard Dielectric Thicknesses and Tolerances (WL-CT300):
| With ED Copper | With RTF Copper | ||
| Thickness (mm) | Tolerance (mm) | Thickness (mm) | Tolerance (mm) |
| 0.127 (5.0 mil) | ±0.012 (0.5 mil) | 0.272 (10.7 mil) | ±0.025 (1.0 mil) |
| 0.254 (10 mil) | ±0.025 (1.0 mil) | 0.526 (20.7 mil) | ±0.038 (1.5 mil) |
| 0.508 (20 mil) | ±0.038 (1.5 mil) | 0.780 (30.7 mil) | ±0.051 (2.0 mil) |
| 0.762 (30 mil) | ±0.050 (2.0 mil) | 1.034 (40.7 mil) | ±0.076 (3.0 mil) |
| 1.016 (40 mil) | ±0.076 (3.0 mil) | 1.542 (60.7 mil) | ±0.100 (4.0 mil) |
| 1.524 (60 mil) | ±0.100 (4.0 mil) | 2.050 (80.7 mil) | ±0.127 (5.0 mil) |
Aluminum-Backed Version (WL-CTxxx-AL):
| Parameter | Specification |
| Metal Base | Aluminum |
| Density | 2.7 g/cm³ |
| Thermal Conductivity | 180 W/(m·K) |
| CTE | 24 ppm/°C |
| Available Aluminum Thicknesses | 0.48, 0.98, 1.48, 1.98, 2.98, 3.98 mm |
| Aluminum Thickness Tolerance | +0.02 / -0.05 mm |
| Available Panel Sizes | 460×610 mm, 460×305 mm |
3. Custom PCB Specifications (Based on WL-CT300)
The following 2-layer rigid PCB has been designed and manufactured using WL-CT300 as the core material.
Construction Details
| Parameter | Specification |
| Layer count | 2 layers |
| Base material | WL-CT300 |
| Finished board thickness | 0.25 mm |
| Stackup | 35 μm Cu + 0.127 mm WL-CT300 core + 35 μm Cu |
| Finished outer Cu weight | 1 oz (35 μm) |
| Via plating thickness | 20 μm |
| Min trace/space | 4/5 mil |
| Min hole size | 0.25 mm |
| Blind vias | None |
| Board dimensions | 66.04 mm × 43.18 mm per piece, tolerance ±0.15 mm |
| Surface finish | Pure Gold Plating |
| Solder mask (both sides) | Not applied |
| Top silkscreen | Black |
| Bottom silkscreen | Not applied |
| Electrical test | 100% performed prior to shipment |
4. Key Advantages of WL-CT300 vs. PTFE-Based Laminates
| Feature | WL-CT300 (Hydrocarbon Ceramic) | Traditional PTFE Laminates |
| PCB Processability | FR4-like (standard processes) | Specialized processes required |
| Circuit Stability | Excellent (thermosetting) | Moderate (thermoplastic) |
| Tg | >280°C | ~230°C (typical) |
| Z-axis CTE | 31 ppm/°C (low) | Higher (typical) |
| Thermal Conductivity | 0.41 W/(m·K) | ~0.3 W/(m·K) |
| Multi-layer Capability | Excellent (multiple press cycles) | Limited |
| Dense Hole & Fine Line Processing | Excellent | More challenging |
5. Frequency and Temperature Stability Characteristics
The WL-CT300 material exhibits excellent frequency and temperature stability, as summarized below:
| Characteristic | Performance |
| Frequency Stability (0.5–25 GHz) | Stable Dk and low loss across the entire frequency range |
| Temperature Stability (-55°C to +150°C) | TCDK of approximately 27 ppm/°C (minimal variation) |
| Usable Temperature Range | Exceeds -55°C to +150°C (practical operating range: -55°C to +260°C) |
6. Applications – Where This PCB Excels
Based on Wangling’s typical applications for WL-CT300, this 0.25 mm thin, 2-layer PCB is well-suited for:
Small form-factor satellite communication modules (low outgassing, radiation tolerant)
Phased-array antenna feed boards (tight εr tolerance ±0.05, stable phase over temp)
Power amplifiers (high Tg, thermal conductivity >0.4 W/m·K)
Automotive radar sensors (compact size, consistent Df up to 24 GHz)
Avionics and space-cabin equipment (vacuum stability, mechanical robustness)
The absence of solder mask also supports high-voltage or corona-sensitive designs where bare dielectric clearance is preferred.
7. Why This WL-CT300-Based PCB Solution Should Be Considered
Superior processability is offered: FR4-like fabrication is enabled, reducing manufacturing complexity and cost compared to PTFE materials.
Excellent electrical performance is achieved: Low loss (Df 0.0025–0.0036) and a stable Dk (3.00 ±0.05) are provided across 0.5–25 GHz.
High thermal reliability is ensured: Continuous operation from -55°C to +260°C is supported, with Tg >280°C and Td of 412°C.
Excellent dimensional stability is delivered: CTE in X/Y (15/14 ppm/°C) is matched to copper, while low Z-axis CTE (31 ppm/°C) ensures plated through-hole reliability.
High thermal conductivity is provided: 0.41 W/(m·K) is offered, which is superior to comparable thermoplastic materials for high-power applications.
Space-grade reliability is demonstrated: Radiation resistance and low outgassing properties are exhibited, meeting aerospace requirements.
High-volume, cost-effective production is available: The material is designed for commercial, high-volume applications with excellent value.
PIM performance is optimized: When paired with RTF copper, PIM values of ≤-158 dBc are achieved, reducing passive intermodulation.
Conclusion
Wangling's WL-CT300 hydrocarbon ceramic laminate, combined with the custom 2-layer PCB design described above, can be regarded as a reliable, low-loss, and highly manufacturable solution for demanding microwave, automotive radar, aerospace, and communication systems. The ability to process this material using standard FR4 techniques provides a significant advantage over PTFE-based alternatives, enabling faster turnaround times, lower costs, and more consistent results.
