6-Layer RO4003C/Tg170 FR-4 PCB with 6.8mm Thickness, Immersion Gold Finish, and No Solder Mask

6-Layer RO4003C/Tg170 FR-4 PCB: 6.8mm Thickness, Immersion Gold Finish, and No Solder Mask

Overview of the 6-Layer RO4003C/Tg170 FR-4 PCB

The 6-Layer RO4003C/Tg170 FR-4 PCB is a highly durable and performance-optimized printed circuit board designed for demanding applications in cellular base stations, automotive radar, and RF systems. This PCB combines Rogers RO4003C and Tg170 FR-4 cores, offering exceptional thermal stability, low dielectric loss, and dimensional reliability. With 6.8mm finished thickness, immersion gold surface finish, and controlled-depth slots, the design ensures long-term reliability and optimal signal performance for high-frequency devices.

This multi-layer PCB is manufactured to IPC-Class-2 standards, ensuring consistent quality and worldwide availability. It's perfect for performance-sensitive, high-volume applications where precise electrical and thermal properties are critical.

PCB Construction Details

The 6-layer rigid PCB is built with a mix of RO4003C high-frequency laminate and Tg170 FR-4, providing a blend of high thermal conductivity and cost-effective manufacturability. Below is a detailed table of its construction specifications:

PCB Stackup

The stackup for this 6-layer rigid PCB alternates between high-performance RO4003C and cost-efficient Tg170 FR-4, ensuring thermal stability and dielectric uniformity. The detailed layer structure is as follows:

PCB Statistics

The 6-layer RO4003C/Tg170 FR-4 PCB is optimized for high-density component placement and reliable signal routing. Below are its key statistics:

• Components: 132
• Total Pads: 456
• Thru Hole Pads: 271
• Top SMT Pads: 166
• Bottom SMT Pads: 19
• Vias: 131
• Nets: 17

Introduction to RO4003C

The Rogers RO4003C laminate is a woven glass-reinforced hydrocarbon/ceramic material that offers the electrical performance of PTFE but with the manufacturability of epoxy-glass laminates. Its low dielectric constant (Dk) of 3.38 ± 0.05 and dissipation factor of 0.0027 at 10GHz make it ideal for high-frequency applications.

Key features of RO4003C include:

1. Low moisture absorption (0.06%) for reliable performance in humid environments.
2. Stable thermal expansion (CTE), ensuring excellent dimensional stability.
3. High thermal conductivity (0.71 W/m/K) for effective heat dissipation.

Applications

This PCB is ideal for applications requiring high-frequency stability and reliability, such as:

1. Cellular Base Station Antennas
2. Automotive Radar and Sensors
3. RF Identification Tags
4. LNBs for Direct Broadcast Satellites

With its 6-layer construction, RO4003C core, and immersion gold finish, the 6-layer RO4003C/Tg170 FR-4 PCB is the perfect choice for demanding RF and microwave systems. Its combination of durability, performance, and cost-efficiency makes it a standout solution for high-volume, performance-critical applications.