|
| MOQ: | 1개 |
| 가격: | 7USD/PCS |
| 표준 포장: | 포장 |
| 배달 기간: | 2-10 영업일 |
| 지불 방법: | T/T, 페이팔 |
| 공급 능력: | 50000PCS |
RT/duroid 6035HTC PCB: High-Performance for RF and Microwave Applications
The RT/duroid 6035HTC PCB is a 2-layer, 30mil PCB designed for high-power RF and microwave applications. It uses RT/duroid 6035HTC, a ceramic-filled PTFE composite ideal for high-frequency circuits, offering excellent thermal conductivity and dielectric performance.
Key Construction Details
PCB Stackup
|
Layer |
Material |
Thickness |
|---|---|---|
|
Copper (Layer 1) |
35μm |
~1.4 mils |
|
RT/duroid 6035HTC |
Dielectric: 30mil |
0.762mm |
|
Copper (Layer 2) |
35μm |
~1.4 mils |
Material Features
This material improves heat dissipation, minimizes signal loss, and ensures long-term performance in rugged environments.
Applications
Choose the RT/duroid 6035HTC PCB for its unparalleled performance, reliable thermal management, and industry-compliant fabrication. Contact us today to get started!
|
|
| MOQ: | 1개 |
| 가격: | 7USD/PCS |
| 표준 포장: | 포장 |
| 배달 기간: | 2-10 영업일 |
| 지불 방법: | T/T, 페이팔 |
| 공급 능력: | 50000PCS |
RT/duroid 6035HTC PCB: High-Performance for RF and Microwave Applications
The RT/duroid 6035HTC PCB is a 2-layer, 30mil PCB designed for high-power RF and microwave applications. It uses RT/duroid 6035HTC, a ceramic-filled PTFE composite ideal for high-frequency circuits, offering excellent thermal conductivity and dielectric performance.
Key Construction Details
PCB Stackup
|
Layer |
Material |
Thickness |
|---|---|---|
|
Copper (Layer 1) |
35μm |
~1.4 mils |
|
RT/duroid 6035HTC |
Dielectric: 30mil |
0.762mm |
|
Copper (Layer 2) |
35μm |
~1.4 mils |
Material Features
This material improves heat dissipation, minimizes signal loss, and ensures long-term performance in rugged environments.
Applications
Choose the RT/duroid 6035HTC PCB for its unparalleled performance, reliable thermal management, and industry-compliant fabrication. Contact us today to get started!
