|
| MOQ: | 1개 |
| 가격: | 0.99-99USD/PCS |
| 표준 포장: | 포장 |
| 배달 기간: | 2-10 영업일 |
| 지불 방법: | T/T, 페이팔 |
| 공급 능력: | 50000PCS |
4-Layer Hybrid High-Frequency PCB – RT/duroid 5880 + FR4 (Immersion Gold, Controlled Depth Trench)
We present our 4-Layer RT/duroid 5880 + FR4 Hybrid PCB – a high-performance, ultra-low-loss circuit board engineered for demanding millimeter-wave, Ku-band, and aerospace applications. The top RF section utilizes Rogers RT/duroid 5880 glass microfiber-reinforced PTFE laminate (Dk 2.20 ±0.02, Df 0.0009 @ 10 GHz), while the bottom layers use High Tg FR4 for mechanical support and cost optimization. This hybrid construction features a 6-layer copper structure (4-layer PCB with additional copper planes), finished with Immersion Gold (2µ") , blue solder mask, and white silkscreen. The board includes controlled depth trenches and meets IPC-6012 Class 3 reliability standards, with 25µm copper plating in each via.
Key Specifications
| Parameter | Details |
| Product Type | 4-Layer Hybrid High-Frequency PCB (6-Layer Copper Structure) |
| Base Materials | RT/duroid 5880 (Top RF section) + High Tg FR4 (Bottom section) |
| Finished Board Thickness | 1.0 mm |
| Board Dimensions | 90 mm × 80 mm = 1 piece |
| Inner Layer Copper Weight | 0.5 oz (17.5 μm) |
| Outer Layer Copper Weight | 1 oz (35 μm) finished |
| Total Copper Layers | 6 (including internal ground/power planes) |
| Solder Mask | Blue (Top & Bottom) |
| Silkscreen | White (Top) |
| Surface Finish | Immersion Gold (ENIG) – 2 microinches (0.05 μm) gold thickness |
| Via Plating Thickness | 25 μm (1 mil) minimum in each hole |
| Special Features | Controlled depth trench (routed cavity / channel) |
| Quality Standard | IPC-6012 Class 3 (High Reliability) |
| Electrical Test | 100% prior to shipment |
| Artwork Format | Gerber RS-274-X |
PCB Stackup (4-Layer with 6-Layer Copper Structure)
What is RT/duroid 5880?
RT/duroid® 5880 is a glass microfiber-reinforced PTFE composite from Rogers Corporation, designed for exacting stripline and microstrip circuit applications. Unlike woven-glass reinforced materials, the randomly oriented microfibers eliminate Dk variation caused by glass weave effects – delivering exceptional dielectric constant uniformity from panel to panel and across frequency.
With the lowest dissipation factor (0.0009 @ 10 GHz) of any reinforced PTFE material, RT/duroid 5880 extends its usefulness to Ku-band, K-band, Ka-band, and millimeter-wave frequencies (up to 100 GHz+). It is easily cut, sheared, and machined to shape, and resistant to all solvents and reagents used in etching printed circuits or plating edges and holes.
Key Properties of RT/duroid 5880
| Property | Typical Value | Condition | Test Method |
| Dielectric Constant (Dk) – Process | 2.20 ±0.02 | 10 GHz / 23°C | IPC-TM-650 2.5.5.5 |
| Dielectric Constant (Dk) – Design | 2.2 | 8–40 GHz | Differential Phase Length Method |
| Dissipation Factor (Df) | 0.0009 | 10 GHz / 23°C | IPC-TM-650 2.5.5.5 |
| Dissipation Factor (Df) | 0.0004 | 1 MHz / 23°C | IPC-TM-650 2.5.5.3 |
| Thermal Coefficient of Dk (TCDk) | -125 ppm/°C | -50 to 150°C | IPC-TM-650 2.5.5.5 |
| Volume Resistivity | 2 × 10⁷ MΩ·cm | C96/35/90 | ASTM D257 |
| Surface Resistivity | 3 × 10⁷ MΩ | C96/35/90 | ASTM D257 |
| Specific Heat | 0.96 J/g/K (0.23 cal/g/°C) | – | Calculated |
| Tensile Modulus (X @ 23°C) | 1,070 MPa (156 kpsi) | A | ASTM D638 |
| Tensile Modulus (Y @ 23°C) | 860 MPa (125 kpsi) | A | ASTM D638 |
| Tensile Strength (X @ 23°C) | 29 MPa (4.2 kpsi) | A | ASTM D638 |
| Tensile Strength (Y @ 23°C) | 27 MPa (3.9 kpsi) | A | ASTM D638 |
| Ultimate Strain (X @ 23°C) | 6.00% | A | ASTM D638 |
| Ultimate Strain (Y @ 23°C) | 4.90% | A | ASTM D638 |
| Compressive Modulus (Z @ 23°C) | 940 MPa (136 kpsi) | A | ASTM D695 |
| Moisture Absorption | 0.02% | 0.062" (1.6mm), D48/50 | ASTM D570 |
| Thermal Conductivity | 0.20 W/m/K | 80°C | ASTM C518 |
| CTE – X axis | 31 ppm/°C | 0–100°C | IPC-TM-650 2.4.41 |
| CTE – Y axis | 48 ppm/°C | 0–100°C | IPC-TM-650 2.4.41 |
| CTE – Z axis | 237 ppm/°C | 0–100°C | IPC-TM-650 2.4.41 |
| Td (Decomposition Temp.) | 500°C | TGA | ASTM D3850 |
| Density | 2.2 g/cm³ | – | ASTM D792 |
| Copper Peel Strength | 31.2 N/mm (5.5 pli) | After solder float, 1 oz EDC | IPC-TM-650 2.4.8 |
| Flammability | V-0 | – | UL 94 |
| Lead-Free Process Compatible | Yes | – | – |
Standard Thicknesses Available for RT/duroid 5880
| Thickness (inches) | Thickness (mm) | Tolerance |
| 0.005" | 0.127 mm | ±0.0005" |
| 0.010" | 0.254 mm | ±0.0007" |
| 0.020" | 0.508 mm | ±0.0015" |
| 0.031" | 0.787 mm | ±0.0020" |
| 0.062" | 1.575 mm | ±0.0030" |
Additional thicknesses available from 0.0035" to 0.375" in varying increments.
Key Advantages of RT/duroid 5880
| Advantage | Description |
| Ultra-Low Loss (Df 0.0009 @ 10 GHz) | Lowest loss of any reinforced PTFE material – ideal for millimeter-wave (up to 100 GHz+) |
| Tight Dk Tolerance (±0.02) | Predictable impedance and phase matching – critical for phased arrays |
| No Glass Weave Effect | Randomly oriented microfibers eliminate Dk variation associated with woven-glass PTFE |
| Uniform Panel-to-Panel | Consistent electrical properties simplify high-volume production |
| Wide Frequency Stability | Dk constant from 500 MHz to 40 GHz+ |
| Low Moisture Absorption (0.02%) | Stable electrical performance in humid environments |
| Process-Friendly | Easily cut, sheared, and machined; resistant to solvents and reagents |
| Low Out-Gassing | Ideal for space and satellite applications |
Typical Applications of RT/duroid 5880
Millimeter-Wave Radar (Automotive, defense, weather)
Phased Array Antennas (5G/6G, satellite, defense)
Commercial Airline Broadband Antennas (In-Flight Connectivity)
Microstrip & Stripline Circuits (Filters, couplers, power dividers)
Satellite Communication Systems (Low out-gassing required)
Point-to-Point Digital Radio Antennas (Backhaul, microwave links)
Guidance Systems (Missile, drone, navigation)
Test & Measurement Fixtures (Up to 100 GHz)
Space-Grade RF Electronics
What is a Controlled Depth Trench?
A Controlled Depth Trench (also known as controlled depth routing, cavity routing, or pocket milling) is a precision machining process that removes material from specific layers of a PCB to a controlled and precise depth, without cutting through the entire board.
In this product, the controlled depth trench is machined into the RT/duroid 5880 section or specific FR4 layers to create:
Key Characteristics
| Parameter | Description |
| Process | CNC routing with depth control (Z-axis precision) |
| Depth Tolerance | Typically ±0.05 mm to ±0.10 mm depending on material |
| Minimum Trench Width | Typically ≥0.8 mm (depending on router bit diameter) |
| Trench Bottom Finish | Can stop on copper layer, prepreg, or within dielectric |
| Inspection Method | Optical or laser depth measurement |
Types of Controlled Depth Trenches
| Type | Description | Typical Application |
| Blind Trench | Stops within dielectric layer | Component cavity, air gap |
| Copper-Bottomed Trench | Stops on a copper layer | Thermal pad, grounding cavity |
| Through Trench (routed slot) | Cuts through entire board | Mechanical clearance, shielding |
| Step Trench | Multiple depths in one cavity | Multi-height component embedding |
Applications of Controlled Depth Trenches in RF PCBs
| Application | Benefit |
| Embedded Passives | Components recessed below surface – reduces height, improves RF performance |
| Air Cavities for RF MEMS | Provides free space around moving structures |
| Antenna Isolation Trenches | Reduces coupling between adjacent radiators |
| Heat Sink Access | Direct thermal path from component to heat sink |
| Wire Bond Pockets | Recessed area for IC wire bonding with short wire lengths |
| Shielding Can Seats | Precise recess for EMI shield placement |
| Dielectric Constant Tuning | Removing material locally changes effective Dk |
Design Considerations for Controlled Depth Trenches
| Consideration | Recommendation |
| Minimum Trench Width | ≥0.8 mm (larger for thicker boards) |
| Corner Radius | ≥0.4 mm (router bit diameter / 2) |
| Depth Tolerance | Specify ±0.05 mm minimum |
| Layer Registration | Critical for trenches stopping on copper layers |
| Fiberglass Fuzzing | PTFE materials (RT/5880) may require post-trench deburring |
| Inspection | Request depth measurement on first article |
Advantages of Controlled Depth Trenches
| Advantage | Description |
| Component Height Reduction | Embed components to reduce overall profile |
| Improved RF Performance | Air cavities reduce losses and parasitic effects |
| Thermal Management | Direct contact between component and heat sink |
| Shielding Integration | Precise seats for EMI shields |
| Design Flexibility | Enable hybrid assembly techniques |
Challenges & Mitigations
| Challenge | Mitigation |
| Depth Control Precision | Use CNC router with Z-axis feedback; specify tolerances |
| Burrs / Fuzzing (PTFE) | Use sharp tools; post-process with vapor honing or manual deburring |
| Layer Registration | Include fiducials; specify trench-to-feature tolerances |
| Increased Fabrication Cost | Balance complexity vs. performance benefit |
We support prototype to volume production with global shipping. Contact us for:
Trench depth measurement reports
Impedance control test coupons
Phase matching verification
Volume pricing and lead times
|
|
| MOQ: | 1개 |
| 가격: | 0.99-99USD/PCS |
| 표준 포장: | 포장 |
| 배달 기간: | 2-10 영업일 |
| 지불 방법: | T/T, 페이팔 |
| 공급 능력: | 50000PCS |
4-Layer Hybrid High-Frequency PCB – RT/duroid 5880 + FR4 (Immersion Gold, Controlled Depth Trench)
We present our 4-Layer RT/duroid 5880 + FR4 Hybrid PCB – a high-performance, ultra-low-loss circuit board engineered for demanding millimeter-wave, Ku-band, and aerospace applications. The top RF section utilizes Rogers RT/duroid 5880 glass microfiber-reinforced PTFE laminate (Dk 2.20 ±0.02, Df 0.0009 @ 10 GHz), while the bottom layers use High Tg FR4 for mechanical support and cost optimization. This hybrid construction features a 6-layer copper structure (4-layer PCB with additional copper planes), finished with Immersion Gold (2µ") , blue solder mask, and white silkscreen. The board includes controlled depth trenches and meets IPC-6012 Class 3 reliability standards, with 25µm copper plating in each via.
Key Specifications
| Parameter | Details |
| Product Type | 4-Layer Hybrid High-Frequency PCB (6-Layer Copper Structure) |
| Base Materials | RT/duroid 5880 (Top RF section) + High Tg FR4 (Bottom section) |
| Finished Board Thickness | 1.0 mm |
| Board Dimensions | 90 mm × 80 mm = 1 piece |
| Inner Layer Copper Weight | 0.5 oz (17.5 μm) |
| Outer Layer Copper Weight | 1 oz (35 μm) finished |
| Total Copper Layers | 6 (including internal ground/power planes) |
| Solder Mask | Blue (Top & Bottom) |
| Silkscreen | White (Top) |
| Surface Finish | Immersion Gold (ENIG) – 2 microinches (0.05 μm) gold thickness |
| Via Plating Thickness | 25 μm (1 mil) minimum in each hole |
| Special Features | Controlled depth trench (routed cavity / channel) |
| Quality Standard | IPC-6012 Class 3 (High Reliability) |
| Electrical Test | 100% prior to shipment |
| Artwork Format | Gerber RS-274-X |
PCB Stackup (4-Layer with 6-Layer Copper Structure)
What is RT/duroid 5880?
RT/duroid® 5880 is a glass microfiber-reinforced PTFE composite from Rogers Corporation, designed for exacting stripline and microstrip circuit applications. Unlike woven-glass reinforced materials, the randomly oriented microfibers eliminate Dk variation caused by glass weave effects – delivering exceptional dielectric constant uniformity from panel to panel and across frequency.
With the lowest dissipation factor (0.0009 @ 10 GHz) of any reinforced PTFE material, RT/duroid 5880 extends its usefulness to Ku-band, K-band, Ka-band, and millimeter-wave frequencies (up to 100 GHz+). It is easily cut, sheared, and machined to shape, and resistant to all solvents and reagents used in etching printed circuits or plating edges and holes.
Key Properties of RT/duroid 5880
| Property | Typical Value | Condition | Test Method |
| Dielectric Constant (Dk) – Process | 2.20 ±0.02 | 10 GHz / 23°C | IPC-TM-650 2.5.5.5 |
| Dielectric Constant (Dk) – Design | 2.2 | 8–40 GHz | Differential Phase Length Method |
| Dissipation Factor (Df) | 0.0009 | 10 GHz / 23°C | IPC-TM-650 2.5.5.5 |
| Dissipation Factor (Df) | 0.0004 | 1 MHz / 23°C | IPC-TM-650 2.5.5.3 |
| Thermal Coefficient of Dk (TCDk) | -125 ppm/°C | -50 to 150°C | IPC-TM-650 2.5.5.5 |
| Volume Resistivity | 2 × 10⁷ MΩ·cm | C96/35/90 | ASTM D257 |
| Surface Resistivity | 3 × 10⁷ MΩ | C96/35/90 | ASTM D257 |
| Specific Heat | 0.96 J/g/K (0.23 cal/g/°C) | – | Calculated |
| Tensile Modulus (X @ 23°C) | 1,070 MPa (156 kpsi) | A | ASTM D638 |
| Tensile Modulus (Y @ 23°C) | 860 MPa (125 kpsi) | A | ASTM D638 |
| Tensile Strength (X @ 23°C) | 29 MPa (4.2 kpsi) | A | ASTM D638 |
| Tensile Strength (Y @ 23°C) | 27 MPa (3.9 kpsi) | A | ASTM D638 |
| Ultimate Strain (X @ 23°C) | 6.00% | A | ASTM D638 |
| Ultimate Strain (Y @ 23°C) | 4.90% | A | ASTM D638 |
| Compressive Modulus (Z @ 23°C) | 940 MPa (136 kpsi) | A | ASTM D695 |
| Moisture Absorption | 0.02% | 0.062" (1.6mm), D48/50 | ASTM D570 |
| Thermal Conductivity | 0.20 W/m/K | 80°C | ASTM C518 |
| CTE – X axis | 31 ppm/°C | 0–100°C | IPC-TM-650 2.4.41 |
| CTE – Y axis | 48 ppm/°C | 0–100°C | IPC-TM-650 2.4.41 |
| CTE – Z axis | 237 ppm/°C | 0–100°C | IPC-TM-650 2.4.41 |
| Td (Decomposition Temp.) | 500°C | TGA | ASTM D3850 |
| Density | 2.2 g/cm³ | – | ASTM D792 |
| Copper Peel Strength | 31.2 N/mm (5.5 pli) | After solder float, 1 oz EDC | IPC-TM-650 2.4.8 |
| Flammability | V-0 | – | UL 94 |
| Lead-Free Process Compatible | Yes | – | – |
Standard Thicknesses Available for RT/duroid 5880
| Thickness (inches) | Thickness (mm) | Tolerance |
| 0.005" | 0.127 mm | ±0.0005" |
| 0.010" | 0.254 mm | ±0.0007" |
| 0.020" | 0.508 mm | ±0.0015" |
| 0.031" | 0.787 mm | ±0.0020" |
| 0.062" | 1.575 mm | ±0.0030" |
Additional thicknesses available from 0.0035" to 0.375" in varying increments.
Key Advantages of RT/duroid 5880
| Advantage | Description |
| Ultra-Low Loss (Df 0.0009 @ 10 GHz) | Lowest loss of any reinforced PTFE material – ideal for millimeter-wave (up to 100 GHz+) |
| Tight Dk Tolerance (±0.02) | Predictable impedance and phase matching – critical for phased arrays |
| No Glass Weave Effect | Randomly oriented microfibers eliminate Dk variation associated with woven-glass PTFE |
| Uniform Panel-to-Panel | Consistent electrical properties simplify high-volume production |
| Wide Frequency Stability | Dk constant from 500 MHz to 40 GHz+ |
| Low Moisture Absorption (0.02%) | Stable electrical performance in humid environments |
| Process-Friendly | Easily cut, sheared, and machined; resistant to solvents and reagents |
| Low Out-Gassing | Ideal for space and satellite applications |
Typical Applications of RT/duroid 5880
Millimeter-Wave Radar (Automotive, defense, weather)
Phased Array Antennas (5G/6G, satellite, defense)
Commercial Airline Broadband Antennas (In-Flight Connectivity)
Microstrip & Stripline Circuits (Filters, couplers, power dividers)
Satellite Communication Systems (Low out-gassing required)
Point-to-Point Digital Radio Antennas (Backhaul, microwave links)
Guidance Systems (Missile, drone, navigation)
Test & Measurement Fixtures (Up to 100 GHz)
Space-Grade RF Electronics
What is a Controlled Depth Trench?
A Controlled Depth Trench (also known as controlled depth routing, cavity routing, or pocket milling) is a precision machining process that removes material from specific layers of a PCB to a controlled and precise depth, without cutting through the entire board.
In this product, the controlled depth trench is machined into the RT/duroid 5880 section or specific FR4 layers to create:
Key Characteristics
| Parameter | Description |
| Process | CNC routing with depth control (Z-axis precision) |
| Depth Tolerance | Typically ±0.05 mm to ±0.10 mm depending on material |
| Minimum Trench Width | Typically ≥0.8 mm (depending on router bit diameter) |
| Trench Bottom Finish | Can stop on copper layer, prepreg, or within dielectric |
| Inspection Method | Optical or laser depth measurement |
Types of Controlled Depth Trenches
| Type | Description | Typical Application |
| Blind Trench | Stops within dielectric layer | Component cavity, air gap |
| Copper-Bottomed Trench | Stops on a copper layer | Thermal pad, grounding cavity |
| Through Trench (routed slot) | Cuts through entire board | Mechanical clearance, shielding |
| Step Trench | Multiple depths in one cavity | Multi-height component embedding |
Applications of Controlled Depth Trenches in RF PCBs
| Application | Benefit |
| Embedded Passives | Components recessed below surface – reduces height, improves RF performance |
| Air Cavities for RF MEMS | Provides free space around moving structures |
| Antenna Isolation Trenches | Reduces coupling between adjacent radiators |
| Heat Sink Access | Direct thermal path from component to heat sink |
| Wire Bond Pockets | Recessed area for IC wire bonding with short wire lengths |
| Shielding Can Seats | Precise recess for EMI shield placement |
| Dielectric Constant Tuning | Removing material locally changes effective Dk |
Design Considerations for Controlled Depth Trenches
| Consideration | Recommendation |
| Minimum Trench Width | ≥0.8 mm (larger for thicker boards) |
| Corner Radius | ≥0.4 mm (router bit diameter / 2) |
| Depth Tolerance | Specify ±0.05 mm minimum |
| Layer Registration | Critical for trenches stopping on copper layers |
| Fiberglass Fuzzing | PTFE materials (RT/5880) may require post-trench deburring |
| Inspection | Request depth measurement on first article |
Advantages of Controlled Depth Trenches
| Advantage | Description |
| Component Height Reduction | Embed components to reduce overall profile |
| Improved RF Performance | Air cavities reduce losses and parasitic effects |
| Thermal Management | Direct contact between component and heat sink |
| Shielding Integration | Precise seats for EMI shields |
| Design Flexibility | Enable hybrid assembly techniques |
Challenges & Mitigations
| Challenge | Mitigation |
| Depth Control Precision | Use CNC router with Z-axis feedback; specify tolerances |
| Burrs / Fuzzing (PTFE) | Use sharp tools; post-process with vapor honing or manual deburring |
| Layer Registration | Include fiducials; specify trench-to-feature tolerances |
| Increased Fabrication Cost | Balance complexity vs. performance benefit |
We support prototype to volume production with global shipping. Contact us for:
Trench depth measurement reports
Impedance control test coupons
Phase matching verification
Volume pricing and lead times
