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RT/duroid 6002 2-Layer PCB bsas 10mil copper clad laminate raw materials with Immersion Silver

RT/duroid 6002 2-Layer PCB bsas 10mil copper clad laminate raw materials with Immersion Silver

MOQ: 1pcs
가격: 0.99-99USD/PCS
표준 포장: 포장
배달 기간: 2-10 근무일
지불 방법: T/T, PayPal
공급 능력: 50000pcs
상세 정보
원래 장소
중국
브랜드 이름
Rogers
인증
ISO9001
모델 번호
RT/Duroid 6002
최소 주문 수량:
1pcs
가격:
0.99-99USD/PCS
포장 세부 사항:
포장
배달 시간:
2-10 근무일
지불 조건:
T/T, PayPal
공급 능력:
50000pcs
제품 설명

RT/duroid 6002 2-Layer PCB: 10mil with Immersion Silver

 

 

The RT/duroid 6002 2-layer PCB is a high-performance solution for microwave and high-frequency applications. Made from Rogers RT/duroid 6002 laminates, it provides low loss, excellent dimensional stability, and mechanical reliability, making it ideal for complex microwave structures and phased array antennas. The Immersion Silver finish ensures superior solderability and electrical performance.

 

RT/duroid 6002 2-Layer PCB bsas 10mil copper clad laminate raw materials with Immersion Silver 0

 

Key Construction Details

Parameter Specification
Base Material Rogers RT/duroid 6002
Layer Count 2 layers
Board Dimensions 68mm x 52mm (1PCS)
Minimum Trace/Space 5/5 mils
Minimum Hole Size 0.25mm
Blind Vias None
Finished Thickness 0.37mm
Copper Weight 1oz (35μm) on both outer layers
Via Plating Thickness 20μm
Surface Finish Immersion Silver
Top Silkscreen None
Bottom Silkscreen None
Top Solder Mask None
Bottom Solder Mask None
Electrical Testing 100% tested before shipment

 

 

Features of RT/duroid 6002 Material

  • Dielectric Constant (Dk): 2.94 ± 0.04 for stable high-frequency performance.
  • Dissipation Factor (Df): 0.0012 at 10GHz for low signal loss.
  • Thermal Conductivity: 0.6 W/m/K for efficient heat dissipation.
  • Thermal Coefficient of Dk: 12 ppm/°C for consistent circuit performance across temperatures.
  • Coefficient of Thermal Expansion (CTE): Z-axis: 24 ppm/°C (low for excellent reliability).
  • Decomposition Temperature (Td): 500°C for thermal durability.
  • Moisture Absorption: 0.02%, ideal for humid environments and space applications.

 

 

Applications

Phased Array Antennas

Ground-Based and Airborne Radar Systems

Global Positioning System (GPS) Antennas

Power Backplanes

Commercial Airline Collision Avoidance Systems

Beam Forming Networks

 

RT/duroid 6002 2-Layer PCB bsas 10mil copper clad laminate raw materials with Immersion Silver 1

 

Why Choose RT/duroid 6002 PCB?

Exceptional High-Frequency Performance: Low loss and tight Dk control for reliable signal integrity.

Thermal and Dimensional Stability: Ideal for demanding environments like space and airborne systems.

Cost-Effective Manufacturing: Compatible with standard PCB processes, reducing costs.

Proven Reliability: Perfect for critical RF and microwave applications.

 

 

The RT/duroid 6002 2-layer PCB is the ideal choice for high-frequency, high-reliability designs, offering superior performance, durability, and cost-effectiveness. Contact us today to learn more about how it can meet your project requirements!

 

상품
제품 세부 정보
RT/duroid 6002 2-Layer PCB bsas 10mil copper clad laminate raw materials with Immersion Silver
MOQ: 1pcs
가격: 0.99-99USD/PCS
표준 포장: 포장
배달 기간: 2-10 근무일
지불 방법: T/T, PayPal
공급 능력: 50000pcs
상세 정보
원래 장소
중국
브랜드 이름
Rogers
인증
ISO9001
모델 번호
RT/Duroid 6002
최소 주문 수량:
1pcs
가격:
0.99-99USD/PCS
포장 세부 사항:
포장
배달 시간:
2-10 근무일
지불 조건:
T/T, PayPal
공급 능력:
50000pcs
제품 설명

RT/duroid 6002 2-Layer PCB: 10mil with Immersion Silver

 

 

The RT/duroid 6002 2-layer PCB is a high-performance solution for microwave and high-frequency applications. Made from Rogers RT/duroid 6002 laminates, it provides low loss, excellent dimensional stability, and mechanical reliability, making it ideal for complex microwave structures and phased array antennas. The Immersion Silver finish ensures superior solderability and electrical performance.

 

RT/duroid 6002 2-Layer PCB bsas 10mil copper clad laminate raw materials with Immersion Silver 0

 

Key Construction Details

Parameter Specification
Base Material Rogers RT/duroid 6002
Layer Count 2 layers
Board Dimensions 68mm x 52mm (1PCS)
Minimum Trace/Space 5/5 mils
Minimum Hole Size 0.25mm
Blind Vias None
Finished Thickness 0.37mm
Copper Weight 1oz (35μm) on both outer layers
Via Plating Thickness 20μm
Surface Finish Immersion Silver
Top Silkscreen None
Bottom Silkscreen None
Top Solder Mask None
Bottom Solder Mask None
Electrical Testing 100% tested before shipment

 

 

Features of RT/duroid 6002 Material

  • Dielectric Constant (Dk): 2.94 ± 0.04 for stable high-frequency performance.
  • Dissipation Factor (Df): 0.0012 at 10GHz for low signal loss.
  • Thermal Conductivity: 0.6 W/m/K for efficient heat dissipation.
  • Thermal Coefficient of Dk: 12 ppm/°C for consistent circuit performance across temperatures.
  • Coefficient of Thermal Expansion (CTE): Z-axis: 24 ppm/°C (low for excellent reliability).
  • Decomposition Temperature (Td): 500°C for thermal durability.
  • Moisture Absorption: 0.02%, ideal for humid environments and space applications.

 

 

Applications

Phased Array Antennas

Ground-Based and Airborne Radar Systems

Global Positioning System (GPS) Antennas

Power Backplanes

Commercial Airline Collision Avoidance Systems

Beam Forming Networks

 

RT/duroid 6002 2-Layer PCB bsas 10mil copper clad laminate raw materials with Immersion Silver 1

 

Why Choose RT/duroid 6002 PCB?

Exceptional High-Frequency Performance: Low loss and tight Dk control for reliable signal integrity.

Thermal and Dimensional Stability: Ideal for demanding environments like space and airborne systems.

Cost-Effective Manufacturing: Compatible with standard PCB processes, reducing costs.

Proven Reliability: Perfect for critical RF and microwave applications.

 

 

The RT/duroid 6002 2-layer PCB is the ideal choice for high-frequency, high-reliability designs, offering superior performance, durability, and cost-effectiveness. Contact us today to learn more about how it can meet your project requirements!

 

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