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RT/duroid 6035HTC PCB built on 2-Layer 60mil substrate Copper Clad Laminate with ENIG Finish

RT/duroid 6035HTC PCB built on 2-Layer 60mil substrate Copper Clad Laminate with ENIG Finish

MOQ: 1pcs
가격: 0.99-99USD/PCS
표준 포장: 포장
배달 기간: 2-10 근무일
지불 방법: T/T, PayPal
공급 능력: 50000pcs
상세 정보
원래 장소
중국
브랜드 이름
Rogers
인증
ISO9001
모델 번호
RT/DUROID 6035HTC
최소 주문 수량:
1pcs
가격:
0.99-99USD/PCS
포장 세부 사항:
포장
배달 시간:
2-10 근무일
지불 조건:
T/T, PayPal
공급 능력:
50000pcs
제품 설명

RT/duroid 6035HTC 2-Layer PCB: 60mil with ENIG Finish

 

 

The RT/duroid 6035HTC 2-layer PCB is a high-performance circuit board designed for high-power RF and microwave applications. Built with Rogers RT/duroid 6035HTC laminates, it offers exceptional thermal conductivity, low insertion loss, and reliable high-frequency performance. The ENIG (Immersion Gold) surface finish ensures excellent solderability and long-term durability.

 

RT/duroid 6035HTC PCB built on 2-Layer 60mil substrate Copper Clad Laminate with ENIG Finish 0

 

Key Construction Details

Parameter Specification
Base Material Rogers RT/duroid 6035HTC
Layer Count 2 layers (Double-sided)
Board Dimensions 77mm x 96mm (± 0.15mm)
Minimum Trace/Space 5/9 mils
Minimum Hole Size 0.3mm
Blind Vias None
Finished Thickness 1.6mm
Copper Weight 1oz (35μm) on both layers
Via Plating Thickness 20μm
Surface Finish ENIG (Immersion Gold)
Top Silkscreen Black
Bottom Silkscreen None
Top Solder Mask None
Bottom Solder Mask None
Electrical Testing 100% tested before shipment

 

 

Features of RT/duroid 6035HTC Material

  • Dielectric Constant (Dk): 3.5 ± 0.05 at 10GHz for stable high-frequency performance.
  • Dissipation Factor (Df): 0.0013 at 10GHz for low signal loss.
  • Thermal Conductivity: 1.44 W/m/K at 80°C for excellent heat dissipation.
  • Moisture Absorption: 0.06%, suitable for humid environments.
  • Thermal Coefficient of Dk: -66 ppm/°C for consistent performance across temperatures.
  • CTE: X-axis: 19 ppm/°C, Y-axis: 19 ppm/°C, Z-axis: 39 ppm/°C
  • Flammability: UL 94 V-0 rated for safety and reliability.

 

RT/duroid 6035HTC PCB built on 2-Layer 60mil substrate Copper Clad Laminate with ENIG Finish 1

 

 

Applications

High-Power RF and Microwave Amplifiers

Power Amplifiers

Power Dividers and Filters

Couplers and Combiners

 

 

Why Choose RT/duroid 6035HTC PCB?

Exceptional Heat Dissipation: Superior thermal conductivity for high-power applications.

Reliable High-Frequency Performance: Low loss and excellent thermal stability.

Cost-Effective Manufacturing: Advanced filler system reduces drilling costs.

Durable and Safe: UL 94 V-0 flammability rating and lead-free compatibility.

 

 

The RT/duroid 6035HTC 2-layer PCB is the perfect choice for high-power, high-reliability designs, offering excellent thermal management, durability, and performance. Contact us today to learn more!

 

상품
제품 세부 정보
RT/duroid 6035HTC PCB built on 2-Layer 60mil substrate Copper Clad Laminate with ENIG Finish
MOQ: 1pcs
가격: 0.99-99USD/PCS
표준 포장: 포장
배달 기간: 2-10 근무일
지불 방법: T/T, PayPal
공급 능력: 50000pcs
상세 정보
원래 장소
중국
브랜드 이름
Rogers
인증
ISO9001
모델 번호
RT/DUROID 6035HTC
최소 주문 수량:
1pcs
가격:
0.99-99USD/PCS
포장 세부 사항:
포장
배달 시간:
2-10 근무일
지불 조건:
T/T, PayPal
공급 능력:
50000pcs
제품 설명

RT/duroid 6035HTC 2-Layer PCB: 60mil with ENIG Finish

 

 

The RT/duroid 6035HTC 2-layer PCB is a high-performance circuit board designed for high-power RF and microwave applications. Built with Rogers RT/duroid 6035HTC laminates, it offers exceptional thermal conductivity, low insertion loss, and reliable high-frequency performance. The ENIG (Immersion Gold) surface finish ensures excellent solderability and long-term durability.

 

RT/duroid 6035HTC PCB built on 2-Layer 60mil substrate Copper Clad Laminate with ENIG Finish 0

 

Key Construction Details

Parameter Specification
Base Material Rogers RT/duroid 6035HTC
Layer Count 2 layers (Double-sided)
Board Dimensions 77mm x 96mm (± 0.15mm)
Minimum Trace/Space 5/9 mils
Minimum Hole Size 0.3mm
Blind Vias None
Finished Thickness 1.6mm
Copper Weight 1oz (35μm) on both layers
Via Plating Thickness 20μm
Surface Finish ENIG (Immersion Gold)
Top Silkscreen Black
Bottom Silkscreen None
Top Solder Mask None
Bottom Solder Mask None
Electrical Testing 100% tested before shipment

 

 

Features of RT/duroid 6035HTC Material

  • Dielectric Constant (Dk): 3.5 ± 0.05 at 10GHz for stable high-frequency performance.
  • Dissipation Factor (Df): 0.0013 at 10GHz for low signal loss.
  • Thermal Conductivity: 1.44 W/m/K at 80°C for excellent heat dissipation.
  • Moisture Absorption: 0.06%, suitable for humid environments.
  • Thermal Coefficient of Dk: -66 ppm/°C for consistent performance across temperatures.
  • CTE: X-axis: 19 ppm/°C, Y-axis: 19 ppm/°C, Z-axis: 39 ppm/°C
  • Flammability: UL 94 V-0 rated for safety and reliability.

 

RT/duroid 6035HTC PCB built on 2-Layer 60mil substrate Copper Clad Laminate with ENIG Finish 1

 

 

Applications

High-Power RF and Microwave Amplifiers

Power Amplifiers

Power Dividers and Filters

Couplers and Combiners

 

 

Why Choose RT/duroid 6035HTC PCB?

Exceptional Heat Dissipation: Superior thermal conductivity for high-power applications.

Reliable High-Frequency Performance: Low loss and excellent thermal stability.

Cost-Effective Manufacturing: Advanced filler system reduces drilling costs.

Durable and Safe: UL 94 V-0 flammability rating and lead-free compatibility.

 

 

The RT/duroid 6035HTC 2-layer PCB is the perfect choice for high-power, high-reliability designs, offering excellent thermal management, durability, and performance. Contact us today to learn more!

 

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